XCV200-5BG352I
- Mfr.Part #
- XCV200-5BG352I
- Manufacturer
- AMD Xilinx
- Package / Case
- 352-LBGA Exposed Pad, Metal
- Datasheet
- Download
- Description
- IC FPGA 260 I/O 352MBGA
- Stock
- 3,483
- In Stock :
- 3,483
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- JESD-30 Code :
- S-PBGA-B352
- Packaging :
- Tray
- Reach Compliance Code :
- not_compliant
- JESD-609 Code :
- e0
- Pin Count :
- 352
- Length :
- 35mm
- Mounting Type :
- Surface Mount
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pbfree Code :
- No
- RoHS Status :
- Non-RoHS Compliant
- Height Seated (Max) :
- 1.7mm
- Supply Voltage :
- 2.5V
- HTS Code :
- 8542.39.00.01
- Width :
- 35mm
- Number of Gates :
- 236666
- Peak Reflow Temperature (Cel) :
- 225
- Number of LABs/CLBs :
- 1176
- Lead Free :
- Contains Lead
- Number of Inputs :
- 260
- Series :
- Virtex®
- Package / Case :
- 352-LBGA Exposed Pad, Metal
- Clock Frequency :
- 294MHz
- Total RAM Bits :
- 57344
- Published :
- 2002
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Temperature :
- -40°C~100°C TJ
- Power Supplies :
- 1.2/3.62.5V
- RAM Size :
- 7kB
- Mount :
- Surface Mount
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Terminal Form :
- Ball
- ECCN Code :
- EAR99
- Terminal Position :
- BOTTOM
- Number of Outputs :
- 260
- Number of I/O :
- 260
- Voltage - Supply :
- 2.375V~2.625V
- Number of Terminations :
- 352
- Base Part Number :
- XCV200
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 1.27mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Logic Elements/Cells :
- 5292
- Datasheets
- XCV200-5BG352I
1.7mm mm FPGAs Virtex® Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352
XCV200-5BG352I Overview
Fpga chips is supplied in the 352-LBGA Exposed Pad, Metal package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 260 I/Os for transferring data in a more coherent manner. There are 5292 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 2.5V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 2.375V~2.625V. It is a type of FPGA belonging to the Virtex® seies. The operating temperature should be kept at -40°C~100°C TJ when operating. There are 260 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 352 terminations. The RAM bits that this device offer is 57344. Its base part number XCV200 can be used to find related parts. The RAM si7kBe of this FPGA module reaches 7kB to ensure normal operation of the program. This FPGA is built as an array of 1176 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Fpga electronics operates from a 1.2/3.62.5V power supply. Its basic building block contains 236666 gates. Fpga semiconductor is equipped wfpga semiconductorh 352 pin count. Typically, fpga semiconductor uses a crystal oscillating at 294MHz .
XCV200-5BG352I Features
260 I/Os
Up to 57344 RAM bits
XCV200-5BG352I Applications
There are a lot of Xilinx Inc.
XCV200-5BG352I FPGAs applications.
- Digital signal processing
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
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