XCV200E-6FG456C
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- Mfr.Part #
- XCV200E-6FG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 284 I/O 456FBGA
- Stock
- 23,831
- In Stock ：
- 23,831
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Lead Free :
- Contains Lead
- Total RAM Bits :
- 114688
- RAM Size :
- 14kB
- Length :
- 23mm
- Pin Count :
- 456
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Voltage - Supply :
- 1.71V~1.89V
- Terminal Pitch :
- 1mm
- Number of Terminations :
- 456
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Position :
- BOTTOM
- Base Part Number :
- XCV200E
- ECCN Code :
- 3A991.D
- Published :
- 2006
- HTS Code :
- 8542.39.00.01
- Number of Pins :
- 456
- Supply Voltage :
- 1.8V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Speed Grade :
- 6
- Number of LABs/CLBs :
- 1176
- Mounting Type :
- Surface Mount
- Clock Frequency :
- 357MHz
- Operating Supply Voltage :
- 1.8V
- Series :
- Virtex®-E
- Number of Outputs :
- 284
- Number of Gates :
- 306393
- Number of I/O :
- 284
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pbfree Code :
- No
- Mount :
- Surface Mount
- Width :
- 23mm
- RoHS Status :
- Non-RoHS Compliant
- Package / Case :
- 456-BBGA
- Terminal Form :
- Ball
- JESD-609 Code :
- e0
- Peak Reflow Temperature (Cel) :
- 225
- Packaging :
- Tray
- Number of Logic Elements/Cells :
- 5292
- Radiation Hardening :
- No
- Datasheets
- XCV200E-6FG456C
FPGAs AMD Xilinx XCV200E-6FG456C Overview
The AMD Xilinx XCV200E-6FG456C is a high-performance Field Programmable Gate Array (FPGA) designed to meet the demanding needs of modern digital circuits. As a versatile component in the FPGA category, this product offers a robust platform for designers to implement complex logic circuits, while maintaining flexibility and scalability. The XCV200E-6FG456C is crafted in a 456-pin FBGA package, supporting a wide range of I/O options and providing substantial functionality for various applications. Its ability to handle 284 I/O points makes it an ideal choice for projects requiring a high degree of connectivity and integration.
XCV200E-6FG456C Features
The XCV200E-6FG456C FPGA from AMD Xilinx features a compact 456FBGA package that enables dense circuit designs with reduced footprint, making it suitable for space-constrained applications. Its extensive I/O capabilities facilitate easier and more flexible interfacing with other hardware components. Moreover, the chip is designed to support rapid prototyping and development, which accelerates the product to market timeline, crucial for competitive technology sectors.
XCV200E-6FG456C Applications
- Telecommunications Equipment: Utilized for its ability to process and manage high-speed data transfers and signal processing, enhancing the performance of routers and switches.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) by providing the necessary computational power and connectivity for real-time sensor data processing and decision-making.
- Consumer Electronics: Applied in smart home devices and high-performance gaming systems, where its capacity for handling multiple input and output configurations is crucial.
- Industrial Automation: Used in automated control systems for manufacturing lines, improving efficiency and reliability through superior logic and control capabilities.
- Aerospace and Defense: Critical in navigation and communication systems, where robustness and reliability are paramount, ensuring performance in challenging environments.
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