XCV200E-6FG456C

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Mfr.Part #
XCV200E-6FG456C
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 284 I/O 456FBGA
Stock
23,831
In Stock :
23,831

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Width :
23mm
HTS Code :
8542.39.00.01
RoHS Status :
Non-RoHS Compliant
Supply Voltage :
1.8V
Total RAM Bits :
114688
Package / Case :
456-BBGA
Operating Supply Voltage :
1.8V
Mounting Type :
Surface Mount
Terminal Position :
BOTTOM
Packaging :
Tray
Pbfree Code :
No
Number of LABs/CLBs :
1176
Number of Terminations :
456
Published :
2006
ECCN Code :
3A991.D
Number of Logic Elements/Cells :
5292
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Outputs :
284
Terminal Pitch :
1mm
Number of I/O :
284
Number of Pins :
456
Base Part Number :
XCV200E
Pin Count :
456
Peak Reflow Temperature (Cel) :
225
JESD-609 Code :
e0
Voltage - Supply :
1.71V~1.89V
Operating Temperature :
0°C~85°C TJ
Mount :
Surface Mount
Lead Free :
Contains Lead
Number of Gates :
306393
Time@Peak Reflow Temperature-Max (s) :
30
Clock Frequency :
357MHz
Speed Grade :
6
Radiation Hardening :
No
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Form :
Ball
Series :
Virtex®-E
Combinatorial Delay of a CLB-Max :
0.47 ns
Length :
23mm
RAM Size :
14kB
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV200E-6FG456C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:456-BBGA, Mounting Type:Surface Mount, Number of Terminations:456, Number of Pins:456, Base Part Number:XCV200E, Operating Temperature:0°C~85°C TJ, XCV200E-6FG456C pinout, XCV200E-6FG456C datasheet PDF, XCV200E-6FG456C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV200E-6FG456C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV200E-6FG456C


FPGAs AMD Xilinx XCV200E-6FG456C Overview

The AMD Xilinx XCV200E-6FG456C is a high-performance Field Programmable Gate Array (FPGA) designed to meet the demanding needs of modern digital circuits. As a versatile component in the FPGA category, this product offers a robust platform for designers to implement complex logic circuits, while maintaining flexibility and scalability. The XCV200E-6FG456C is crafted in a 456-pin FBGA package, supporting a wide range of I/O options and providing substantial functionality for various applications. Its ability to handle 284 I/O points makes it an ideal choice for projects requiring a high degree of connectivity and integration.

XCV200E-6FG456C Features

The XCV200E-6FG456C FPGA from AMD Xilinx features a compact 456FBGA package that enables dense circuit designs with reduced footprint, making it suitable for space-constrained applications. Its extensive I/O capabilities facilitate easier and more flexible interfacing with other hardware components. Moreover, the chip is designed to support rapid prototyping and development, which accelerates the product to market timeline, crucial for competitive technology sectors.

XCV200E-6FG456C Applications

  • Telecommunications Equipment: Utilized for its ability to process and manage high-speed data transfers and signal processing, enhancing the performance of routers and switches.
  • Automotive Systems: Supports advanced driver-assistance systems (ADAS) by providing the necessary computational power and connectivity for real-time sensor data processing and decision-making.
  • Consumer Electronics: Applied in smart home devices and high-performance gaming systems, where its capacity for handling multiple input and output configurations is crucial.
  • Industrial Automation: Used in automated control systems for manufacturing lines, improving efficiency and reliability through superior logic and control capabilities.
  • Aerospace and Defense: Critical in navigation and communication systems, where robustness and reliability are paramount, ensuring performance in challenging environments.
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