XCV200E-6BG352C

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Mfr.Part #
XCV200E-6BG352C
Manufacturer
AMD Xilinx
Package / Case
352-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 260 I/O 352MBGA
Stock
40,752
In Stock :
40,752

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2006
Base Part Number :
XCV200E
Number of Outputs :
260
Combinatorial Delay of a CLB-Max :
0.47 ns
Series :
Virtex®-E
Terminal Form :
Ball
Mounting Type :
Surface Mount
Length :
35mm
Mount :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Speed Grade :
6
Terminal Pitch :
1.27mm
JESD-30 Code :
S-PBGA-B352
Width :
35mm
Number of Logic Elements/Cells :
5292
Terminal Position :
BOTTOM
Radiation Hardening :
No
Operating Supply Voltage :
1.8V
Time@Peak Reflow Temperature-Max (s) :
30
Voltage - Supply :
1.71V~1.89V
Packaging :
Tray
Clock Frequency :
357MHz
Height Seated (Max) :
1.7mm
Supply Voltage :
1.8V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Terminations :
352
ECCN Code :
3A991.D
Lead Free :
Contains Lead
Pin Count :
352
RAM Size :
14kB
Number of LABs/CLBs :
1176
Package / Case :
352-LBGA Exposed Pad, Metal
HTS Code :
8542.39.00.01
Number of Gates :
306393
Peak Reflow Temperature (Cel) :
225
Operating Temperature :
0°C~85°C TJ
Number of I/O :
260
Number of Inputs :
260
Pbfree Code :
No
JESD-609 Code :
e0
Total RAM Bits :
114688
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV200E-6BG352C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XCV200E, Mounting Type:Surface Mount, Number of Terminations:352, Package / Case:352-LBGA Exposed Pad, Metal, Operating Temperature:0°C~85°C TJ, XCV200E-6BG352C pinout, XCV200E-6BG352C datasheet PDF, XCV200E-6BG352C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV200E-6BG352C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.7mm mm FPGAs Virtex®-E Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352

XCV200E-6BG352C Overview


This package is included in the 352-LBGA Exposed Pad, Metal package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.8V volts power it. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 1.71V~1.89V . An FPGA belonging to the Virtex®-E series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. With this device, you will be able to make use of 260 outputs. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The total number of terminations is 352. This device is equipped with 114688 RAM bits in terms of its RAM si114688e. Parts related to this part can be found using its base part number XCV200E. During the configuration of this FPGA module, the RAM si14kBe reaches 14kB to ensure that the program runs normally. An array of 1176 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.8V supply voltage, designers can take full advantage of its flexibility. Fpga semiconductor is made up of 306393 gates as fpga semiconductors basic building block. The device has a total of 352 pins on fpga semiconductor. A crystal oscillating at 357MHz is one of the most common components of this device.

XCV200E-6BG352C Features


260 I/Os
Up to 114688 RAM bits


XCV200E-6BG352C Applications


There are a lot of Xilinx Inc.
XCV200E-6BG352C FPGAs applications.


  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
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