XCV2000E-8BG560C

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Mfr.Part #
XCV2000E-8BG560C
Manufacturer
AMD Xilinx
Package / Case
560-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 404 I/O 560MBGA
Stock
40,265
In Stock :
40,265

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
RAM Size :
80kB
Packaging :
Tray
Number of Terminations :
560
Pbfree Code :
No
Number of Inputs :
404
JESD-30 Code :
S-PBGA-B560
Radiation Hardening :
No
Terminal Form :
Ball
Width :
42.5mm
Time@Peak Reflow Temperature-Max (s) :
30
JESD-609 Code :
e0
Peak Reflow Temperature (Cel) :
225
Total RAM Bits :
655360
Mounting Type :
Surface Mount
Package / Case :
560-LBGA Exposed Pad, Metal
RoHS Status :
Non-RoHS Compliant
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Supply Voltage :
1.8V
Clock Frequency :
416MHz
Terminal Pitch :
1.27mm
Height Seated (Max) :
1.7mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pin Count :
560
Mount :
Surface Mount
Combinatorial Delay of a CLB-Max :
0.4 ns
Length :
42.5mm
Number of Logic Elements/Cells :
43200
Voltage - Supply :
1.71V~1.89V
Lead Free :
Contains Lead
Published :
2004
ECCN Code :
EAR99
Operating Temperature :
0°C~85°C TJ
Supply Voltage :
1.8V
Number of I/O :
404
Number of Gates :
2541952
Number of LABs/CLBs :
9600
Speed Grade :
8
Base Part Number :
XCV2000E
Series :
Virtex®-E
Terminal Position :
BOTTOM
Number of Outputs :
404
Terminal Finish :
Tin/Lead (Sn63Pb37)
Datasheets
XCV2000E-8BG560C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-8BG560C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:560, Mounting Type:Surface Mount, Package / Case:560-LBGA Exposed Pad, Metal, Operating Temperature:0°C~85°C TJ, Base Part Number:XCV2000E, XCV2000E-8BG560C pinout, XCV2000E-8BG560C datasheet PDF, XCV2000E-8BG560C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-8BG560C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.7mm mm FPGAs Virtex®-E Series 560-LBGA Exposed Pad, Metal 1.27mm mm 560

XCV2000E-8BG560C Overview


A 560-LBGA Exposed Pad, Metal package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 404 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 43200 logic elements/cells. An electrical supply voltage of 1.8V powers it. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 1.71V~1.89V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Virtex®-E series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In order to make this device as versatile as possible, there are 404 different outputs included. It is for space saving reasons that this FPGA model is contained in Tray. As a whole, it has 560 terminations. The RAM bits that are offered by this fpga chips are 655360. Related parts can be found by using its base part number XCV2000E. The FPGA module's RAM si80kBe reaches 80kB in order to ensure that the program operates in a normal manner. Fpga electronics contains 9600 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 1.8V-volt supply allows designers to fully utilize its flexibility. Among its basic building blocks, there are 2541952 gates that are included in it. In addition to this, it has 560 pins. Normally, fpga semiconductor uses an oscillator, which oscillates at 416MHz, to create the signal.

XCV2000E-8BG560C Features


404 I/Os
Up to 655360 RAM bits


XCV2000E-8BG560C Applications


There are a lot of Xilinx Inc.
XCV2000E-8BG560C FPGAs applications.


  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
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