XCV2000E-7FG860I

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Mfr.Part #
XCV2000E-7FG860I
Manufacturer
AMD Xilinx
Package / Case
860-BGA
Datasheet
Download
Description
IC FPGA 660 I/O 860FBGA
Stock
28,165
In Stock :
28,165

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Series :
Virtex®-E
Number of I/O :
660
Supply Voltage :
1.8V
Width :
42.5mm
JESD-609 Code :
e0
RAM Size :
80kB
Lead Free :
Contains Lead
Number of Terminations :
860
Operating Temperature :
-40°C~100°C TJ
Number of LABs/CLBs :
9600
Mounting Type :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Package / Case :
860-BGA
HTS Code :
8542.39.00.01
Terminal Pitch :
1mm
Qualification Status :
Not Qualified
Number of Equivalent Gates :
518400
Mount :
Surface Mount
Power Supplies :
1.2/3.61.8V
Peak Reflow Temperature (Cel) :
225
Pin Count :
860
Time@Peak Reflow Temperature-Max (s) :
30
Published :
2004
Number of Inputs :
660
Reach Compliance Code :
not_compliant
Clock Frequency :
400MHz
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Length :
42.5mm
Terminal Form :
Ball
Total RAM Bits :
655360
Number of Gates :
2541952
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Base Part Number :
XCV2000E
Voltage - Supply :
1.71V~1.89V
Height Seated (Max) :
2.2mm
Combinatorial Delay of a CLB-Max :
0.42 ns
JESD-30 Code :
S-PBGA-B860
Terminal Position :
BOTTOM
Number of Logic Elements/Cells :
43200
ECCN Code :
3A001.A.7.A
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of Outputs :
660
Datasheets
XCV2000E-7FG860I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-7FG860I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:860, Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, Package / Case:860-BGA, Base Part Number:XCV2000E, XCV2000E-7FG860I pinout, XCV2000E-7FG860I datasheet PDF, XCV2000E-7FG860I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-7FG860I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



2.2mm mm FPGAs Virtex®-E Series 860-BGA 1mm mm 860

XCV2000E-7FG860I Overview


In the 860-BGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 660 I/O ports for more coherent data transfer. To form a fundamental building block, there are 43200 logic elements/cells. In order to operate fpga chips, a voltage supply of 1.8V volts is required. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.71V~1.89V-volt supply voltage required for the device to operate. The Virtex®-E Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. A total of 660 outputs are incorporated into this device. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. 860 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 655360 bFpga chipss. You can find related parts by using the part number XCV2000E, which is its base part number. It is crucial that the RAM si80kBe of this FPGA module reaches 80kB so that the program can run normally. A total of 9600 LABs/CLBs are included in this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. There is a 1.2/3.61.8V power supply that is required to operate it. There are 2541952 gates in its basic building block. With a total of 860 pins, it is equipped with a high level of security. It usually uses a 400MHz crystal. This design is implemented using 518400 equivalent gates on the FPGA.

XCV2000E-7FG860I Features


660 I/Os
Up to 655360 RAM bits


XCV2000E-7FG860I Applications


There are a lot of Xilinx Inc.
XCV2000E-7FG860I FPGAs applications.


  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
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