XCV2000E-6FG860I

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Mfr.Part #
XCV2000E-6FG860I
Manufacturer
AMD Xilinx
Package / Case
860-BGA
Datasheet
Download
Description
IC FPGA 660 I/O 860FBGA
Stock
41,960
In Stock :
41,960

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
9600
Published :
2004
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Form :
Ball
Voltage - Supply :
1.71V~1.89V
JESD-30 Code :
S-PBGA-B860
Terminal Finish :
Tin/Lead (Sn63Pb37)
Pin Count :
860
Supply Voltage :
1.8V
Number of Inputs :
660
Total RAM Bits :
655360
Lead Free :
Contains Lead
Terminal Pitch :
1mm
ECCN Code :
3A001.A.7.A
Packaging :
Tray
Peak Reflow Temperature (Cel) :
225
Reach Compliance Code :
not_compliant
RAM Size :
80kB
Length :
42.5mm
Number of Outputs :
660
Terminal Position :
BOTTOM
Width :
42.5mm
RoHS Status :
Non-RoHS Compliant
Package / Case :
860-BGA
Number of Logic Elements/Cells :
43200
Mounting Type :
Surface Mount
Number of Equivalent Gates :
518400
Clock Frequency :
357MHz
Height Seated (Max) :
2.2mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code :
e0
HTS Code :
8542.39.00.01
Number of I/O :
660
Number of Terminations :
860
Operating Temperature :
-40°C~100°C TJ
Time@Peak Reflow Temperature-Max (s) :
30
Series :
Virtex®-E
Mount :
Surface Mount
Qualification Status :
Not Qualified
Number of Gates :
2541952
Power Supplies :
1.2/3.61.8V
Combinatorial Delay of a CLB-Max :
0.47 ns
Base Part Number :
XCV2000E
Datasheets
XCV2000E-6FG860I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-6FG860I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:860-BGA, Mounting Type:Surface Mount, Number of Terminations:860, Operating Temperature:-40°C~100°C TJ, Base Part Number:XCV2000E, XCV2000E-6FG860I pinout, XCV2000E-6FG860I datasheet PDF, XCV2000E-6FG860I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-6FG860I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



2.2mm mm FPGAs Virtex®-E Series 860-BGA 1mm mm 860

XCV2000E-6FG860I Overview


There are two packages that contain fpga chips: 860-BGA package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. Having 660 I/Os makes data transfers more coherent. Logic blocks consist of 43200 logic elements/cells. The supply voltage is 1.8V volts. An attachment Surface Mount allows the FPGA module to be attached to the development board. The supply voltage of the device is 1.71V~1.89V , at which it runs. The Virtex®-E series FPGA is a type of FPGA that belongs to the Virtex®-E family of FPGAs. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. This device is equipped with 660 separate outputs, which makes it a very versatile device. There is an FPGA model contained in Tray in order to conserve space. In total, it has 860 terminations on each end. A device like this one offers 655360 RAM bits, which is a considerable amount of memory. In order to find related parts, use the part number XCV2000E as a base. This FPGA module has a RAM si80kBe of 80kB that is sufficient to make sure that the program is able to run normally. A total of 9600 LABs/CLBs make up this FPGA array. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. The device runs on a 1.2/3.61.8V battery and requires no additional power supply to operate. The building block that forms the basis of the system contains 2541952 gates. This device has a pin count of 860 in fpga semiconductor. It usually uses a crystal oscillating at a frequency of 357MHz in order to do its work. The FPGA implements the design by using 518400 equivalent gates in order to achieve the desired result.

XCV2000E-6FG860I Features


660 I/Os
Up to 655360 RAM bits


XCV2000E-6FG860I Applications


There are a lot of Xilinx Inc.
XCV2000E-6FG860I FPGAs applications.


  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
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