XCV2000E-6FG860C

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Mfr.Part #
XCV2000E-6FG860C
Manufacturer
AMD Xilinx
Package / Case
860-BGA
Datasheet
Download
Description
IC FPGA 660 I/O 860FBGA
Stock
41,285
In Stock :
41,285

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Length :
42.5mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of LABs/CLBs :
9600
JESD-30 Code :
S-PBGA-B860
Voltage - Supply :
1.71V~1.89V
Base Part Number :
XCV2000E
Number of Terminations :
860
Package / Case :
860-BGA
Mounting Type :
Surface Mount
Terminal Pitch :
1mm
Terminal Position :
BOTTOM
RAM Size :
80kB
Mount :
Surface Mount
Number of I/O :
660
Packaging :
Tray
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of Equivalent Gates :
518400
RoHS Status :
Non-RoHS Compliant
Clock Frequency :
357MHz
Peak Reflow Temperature (Cel) :
225
Number of Logic Elements/Cells :
43200
Terminal Form :
Ball
Time@Peak Reflow Temperature-Max (s) :
30
Width :
42.5mm
Pin Count :
860
Published :
2004
Supply Voltage :
1.8V
Number of Gates :
2541952
Power Supplies :
1.2/3.61.8V
Lead Free :
Contains Lead
Height Seated (Max) :
2.2mm
Series :
Virtex®-E
Qualification Status :
Not Qualified
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
HTS Code :
8542.39.00.01
Total RAM Bits :
655360
Operating Temperature :
0°C~85°C TJ
Reach Compliance Code :
not_compliant
Number of Inputs :
660
JESD-609 Code :
e0
Number of Outputs :
660
Combinatorial Delay of a CLB-Max :
0.47 ns
ECCN Code :
3A001.A.7.A
Datasheets
XCV2000E-6FG860C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-6FG860C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XCV2000E, Number of Terminations:860, Package / Case:860-BGA, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, XCV2000E-6FG860C pinout, XCV2000E-6FG860C datasheet PDF, XCV2000E-6FG860C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-6FG860C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



2.2mm mm FPGAs Virtex®-E Series 860-BGA 1mm mm 860

XCV2000E-6FG860C Overview


Fpga chips is supplied in the 860-BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 660 I/Os for transferring data in a more coherent manner. There are 43200 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.8V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~1.89V. It is a type of FPGA belonging to the Virtex®-E seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 660 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 860 terminations. The RAM bits that this device offer is 655360. Its base part number XCV2000E can be used to find related parts. The RAM si80kBe of this FPGA module reaches 80kB to ensure normal operation of the program. This FPGA is built as an array of 9600 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Fpga electronics operates from a 1.2/3.61.8V power supply. Its basic building block contains 2541952 gates. Fpga semiconductor is equipped wfpga semiconductorh 860 pin count. Typically, fpga semiconductor uses a crystal oscillating at 357MHz . 518400 equivalent gates are used for the design implement in the FPGA.

XCV2000E-6FG860C Features


660 I/Os
Up to 655360 RAM bits


XCV2000E-6FG860C Applications


There are a lot of Xilinx Inc.
XCV2000E-6FG860C FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
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