XCV2000E-6FG860C
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- Mfr.Part #
- XCV2000E-6FG860C
- Manufacturer
- AMD Xilinx
- Package / Case
- 860-BGA
- Datasheet
- Download
- Description
- IC FPGA 660 I/O 860FBGA
- Stock
- 41,285
- In Stock ：
- 41,285
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Clock Frequency :
- 357MHz
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Pin Count :
- 860
- JESD-30 Code :
- S-PBGA-B860
- Terminal Pitch :
- 1mm
- Width :
- 42.5mm
- Published :
- 2004
- Series :
- Virtex®-E
- Package / Case :
- 860-BGA
- Qualification Status :
- Not Qualified
- Mounting Type :
- Surface Mount
- Power Supplies :
- 1.2/3.61.8V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Reach Compliance Code :
- not_compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of I/O :
- 660
- JESD-609 Code :
- e0
- Lead Free :
- Contains Lead
- Peak Reflow Temperature (Cel) :
- 225
- RAM Size :
- 80kB
- RoHS Status :
- Non-RoHS Compliant
- Base Part Number :
- XCV2000E
- Supply Voltage :
- 1.8V
- ECCN Code :
- 3A001.A.7.A
- HTS Code :
- 8542.39.00.01
- Mount :
- Surface Mount
- Number of Terminations :
- 860
- Number of Outputs :
- 660
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Terminal Position :
- BOTTOM
- Number of Logic Elements/Cells :
- 43200
- Number of Equivalent Gates :
- 518400
- Terminal Form :
- Ball
- Number of Gates :
- 2541952
- Length :
- 42.5mm
- Total RAM Bits :
- 655360
- Number of Inputs :
- 660
- Operating Temperature :
- 0°C~85°C TJ
- Packaging :
- Tray
- Voltage - Supply :
- 1.71V~1.89V
- Height Seated (Max) :
- 2.2mm
- Number of LABs/CLBs :
- 9600
- Datasheets
- XCV2000E-6FG860C
XCV2000E-6FG860C Documents
2.2mm mm FPGAs Virtex®-E Series 860-BGA 1mm mm 860
XCV2000E-6FG860C Overview
Fpga chips is supplied in the 860-BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 660 I/Os for transferring data in a more coherent manner. There are 43200 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.8V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~1.89V. It is a type of FPGA belonging to the Virtex®-E seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 660 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 860 terminations. The RAM bits that this device offer is 655360. Its base part number XCV2000E can be used to find related parts. The RAM si80kBe of this FPGA module reaches 80kB to ensure normal operation of the program. This FPGA is built as an array of 9600 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Fpga electronics operates from a 1.2/3.61.8V power supply. Its basic building block contains 2541952 gates. Fpga semiconductor is equipped wfpga semiconductorh 860 pin count. Typically, fpga semiconductor uses a crystal oscillating at 357MHz . 518400 equivalent gates are used for the design implement in the FPGA.
XCV2000E-6FG860C Features
660 I/Os
Up to 655360 RAM bits
XCV2000E-6FG860C Applications
There are a lot of Xilinx Inc.
XCV2000E-6FG860C FPGAs applications.
- Digital signal processing
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
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