XCV2000E-6FG680I

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Mfr.Part #
XCV2000E-6FG680I
Manufacturer
AMD Xilinx
Package / Case
680-LBGA Exposed Pad
Datasheet
Download
Description
IC FPGA 512 I/O 680FTEBGA
Stock
7,371
In Stock :
7,371

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Height Seated (Max) :
1.9mm
Lead Free :
Contains Lead
Number of Equivalent Gates :
518400
RoHS Status :
Non-RoHS Compliant
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Pbfree Code :
No
Number of Inputs :
512
Width :
40mm
Number of Outputs :
512
Total RAM Bits :
655360
Number of Logic Elements/Cells :
43200
JESD-609 Code :
e0
Terminal Pitch :
1mm
Pin Count :
680
Terminal Position :
BOTTOM
Published :
2013
Number of LABs/CLBs :
9600
HTS Code :
8542.39.00.01
Number of Gates :
2541952
Number of Terminations :
680
Package / Case :
680-LBGA Exposed Pad
Mount :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Combinatorial Delay of a CLB-Max :
0.47 ns
ECCN Code :
EAR99
Speed Grade :
6
Length :
40mm
Time@Peak Reflow Temperature-Max (s) :
30
Base Part Number :
XCV2000E
Operating Supply Voltage :
1.8V
Peak Reflow Temperature (Cel) :
225
Operating Temperature :
-40°C~100°C TJ
RAM Size :
80kB
Number of I/O :
512
Packaging :
Tray
Voltage - Supply :
1.71V~1.89V
Series :
Virtex®-E
Supply Voltage :
1.8V
Terminal Form :
Ball
Clock Frequency :
357MHz
Radiation Hardening :
No
Datasheets
XCV2000E-6FG680I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-6FG680I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:680, Package / Case:680-LBGA Exposed Pad, Base Part Number:XCV2000E, Operating Temperature:-40°C~100°C TJ, XCV2000E-6FG680I pinout, XCV2000E-6FG680I datasheet PDF, XCV2000E-6FG680I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV2000E-6FG680I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.9mm mm FPGAs Virtex®-E Series 680-LBGA Exposed Pad 1mm mm 680

XCV2000E-6FG680I Overview


In the package 680-LBGA Exposed Pad, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 512 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 43200 logic elements/cells. Supply voltage is 1.8V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.71V~1.89V, this device operates with ease. This is a type of FPGA that is part of the Virtex®-E series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In this device, 512 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 680. Fpga electronics is worth mentioning that this device provides 655360 bfpga electronics s of RAM. XCV2000E is the base part number that can be used to identify related parts. The RAM si80kBe of this FPGA module reaches 80kB so as to guarantee the normal operation of the program during operation. The FPGA is built as an array of 9600 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.8V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 2541952 gates. I am going to present you with a device that is equipped with 680 pins. Fpga semiconductor typically uses a crystal oscillating at 357MHz. There are 518400 equivalent gates implemented by the FPGA in order to implement the design.

XCV2000E-6FG680I Features


512 I/Os
Up to 655360 RAM bits


XCV2000E-6FG680I Applications


There are a lot of Xilinx Inc.
XCV2000E-6FG680I FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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