XCV200-6FG456C
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- Mfr.Part #
- XCV200-6FG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 284 I/O 456FBGA
- Stock
- 40,721
- In Stock ：
- 40,721
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-609 Code :
- e0
- Packaging :
- Tray
- RAM Size :
- 7kB
- Number of Logic Elements/Cells :
- 5292
- Number of Gates :
- 236666
- Power Supplies :
- 1.2/3.62.5V
- Terminal Form :
- Ball
- Pin Count :
- 456
- Package / Case :
- 456-BBGA
- ECCN Code :
- EAR99
- Voltage - Supply :
- 2.375V~2.625V
- Terminal Position :
- BOTTOM
- Mounting Type :
- Surface Mount
- Number of Pins :
- 456
- Operating Temperature :
- 0°C~85°C TJ
- Series :
- Virtex®
- Terminal Pitch :
- 1mm
- Clock Frequency :
- 333MHz
- Pbfree Code :
- No
- Number of I/O :
- 284
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Base Part Number :
- XCV200
- Published :
- 2000
- Supply Voltage :
- 2.5V
- Qualification Status :
- Not Qualified
- Reach Compliance Code :
- not_compliant
- Total RAM Bits :
- 57344
- Number of LABs/CLBs :
- 1176
- Number of Outputs :
- 284
- Mount :
- Surface Mount
- Height Seated (Max) :
- 2.6mm
- Length :
- 23mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Lead Free :
- Contains Lead
- RoHS Status :
- Non-RoHS Compliant
- Number of Terminations :
- 456
- Width :
- 23mm
- HTS Code :
- 8542.39.00.01
- Combinatorial Delay of a CLB-Max :
- 0.6 ns
- Peak Reflow Temperature (Cel) :
- 225
- Datasheets
- XCV200-6FG456C
XCV200-6FG456C Documents
FPGAs AMD Xilinx XCV200-6FG456C Overview
The FPGAs AMD Xilinx XCV200-6FG456C represents a pinnacle of adaptability and efficiency in the field of integrated circuits, designed by AMD Xilinx to cater to sophisticated digital environments. This FPGA (Field Programmable Gate Array) module is engineered to provide a flexible and powerful platform for custom hardware logic operations with its 284 I/O pins housed in a compact 456FBGA package. Its capacity to handle a multitude of programmable logic operations makes it a premier choice for developers looking to push the boundaries of technology in various applications.
XCV200-6FG456C Features
This FPGA offers a robust set of features including a high pin count which facilitates extensive interfacing with other hardware components. The 456FBGA packaging not only ensures a reduced footprint on system boards but also enhances thermal management and reliability under diverse operating conditions. Moreover, the XCV200-6FG456C's flexible architecture allows it to be configured for a vast array of applications, making it immensely versatile.
XCV200-6FG456C Applications
- Telecommunications: Utilized in infrastructure for data transmission and reception, enhancing capabilities in routers and switches to handle high-speed data operations.
- Automotive: Integrated into driver assistance systems, providing the processing power needed for real-time sensor data interpretation and response mechanisms.
- Consumer Electronics: Central to the development of consumer electronics such as high-performance gaming consoles and smart TVs, delivering the necessary compute power for rich multimedia experiences.
- Industrial Automation: Empowers complex industrial automation systems, from robotic assembly lines to process control units, facilitating efficient, programmable logic controls that adapt to new processes and products quickly.
- Medical Devices: Key in medical imaging devices, where high data throughput and real-time processing are critical for accurate diagnostics and patient monitoring.
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