XCV200-6FG456C
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- Mfr.Part #
- XCV200-6FG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 284 I/O 456FBGA
- Stock
- 40,721
- In Stock ：
- 40,721
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Outputs :
- 284
- Voltage - Supply :
- 2.375V~2.625V
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Packaging :
- Tray
- Total RAM Bits :
- 57344
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Gates :
- 236666
- Operating Temperature :
- 0°C~85°C TJ
- Number of LABs/CLBs :
- 1176
- Combinatorial Delay of a CLB-Max :
- 0.6 ns
- Mount :
- Surface Mount
- Pbfree Code :
- No
- Number of Terminations :
- 456
- Length :
- 23mm
- Power Supplies :
- 1.2/3.62.5V
- HTS Code :
- 8542.39.00.01
- RoHS Status :
- Non-RoHS Compliant
- Published :
- 2000
- Peak Reflow Temperature (Cel) :
- 225
- Number of I/O :
- 284
- Base Part Number :
- XCV200
- Width :
- 23mm
- Package / Case :
- 456-BBGA
- Series :
- Virtex®
- Reach Compliance Code :
- not_compliant
- Clock Frequency :
- 333MHz
- Supply Voltage :
- 2.5V
- Lead Free :
- Contains Lead
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Position :
- BOTTOM
- Number of Logic Elements/Cells :
- 5292
- Pin Count :
- 456
- Number of Pins :
- 456
- Mounting Type :
- Surface Mount
- JESD-609 Code :
- e0
- RAM Size :
- 7kB
- Terminal Pitch :
- 1mm
- ECCN Code :
- EAR99
- Height Seated (Max) :
- 2.6mm
- Datasheets
- XCV200-6FG456C
FPGAs AMD Xilinx XCV200-6FG456C Overview
The FPGAs AMD Xilinx XCV200-6FG456C represents a pinnacle of adaptability and efficiency in the field of integrated circuits, designed by AMD Xilinx to cater to sophisticated digital environments. This FPGA (Field Programmable Gate Array) module is engineered to provide a flexible and powerful platform for custom hardware logic operations with its 284 I/O pins housed in a compact 456FBGA package. Its capacity to handle a multitude of programmable logic operations makes it a premier choice for developers looking to push the boundaries of technology in various applications.
XCV200-6FG456C Features
This FPGA offers a robust set of features including a high pin count which facilitates extensive interfacing with other hardware components. The 456FBGA packaging not only ensures a reduced footprint on system boards but also enhances thermal management and reliability under diverse operating conditions. Moreover, the XCV200-6FG456C's flexible architecture allows it to be configured for a vast array of applications, making it immensely versatile.
XCV200-6FG456C Applications
- Telecommunications: Utilized in infrastructure for data transmission and reception, enhancing capabilities in routers and switches to handle high-speed data operations.
- Automotive: Integrated into driver assistance systems, providing the processing power needed for real-time sensor data interpretation and response mechanisms.
- Consumer Electronics: Central to the development of consumer electronics such as high-performance gaming consoles and smart TVs, delivering the necessary compute power for rich multimedia experiences.
- Industrial Automation: Empowers complex industrial automation systems, from robotic assembly lines to process control units, facilitating efficient, programmable logic controls that adapt to new processes and products quickly.
- Medical Devices: Key in medical imaging devices, where high data throughput and real-time processing are critical for accurate diagnostics and patient monitoring.
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