XCV200-6BG256C

Manufacturer :

AMD Xilinx

Product Category :

FPGAs (Field Programmable Gate Array)

Terminal Form :

Ball

Number of Outputs :

180

ECCN Code :

EAR99

Number of Pins :

256

Time@Peak Reflow Temperature-Max (s) :

30

Terminal Finish :

Tin/Lead (Sn63Pb37)

Terminal Position :

BOTTOM

Reach Compliance Code :

not_compliant

Qualification Status :

Not Qualified

Series :

Virtex®

Total RAM Bits :

57344

Mount :

Surface Mount

Packaging :

Tray

Pbfree Code :

No

Number of LABs/CLBs :

1176

HTS Code :

8542.39.00.01

Height Seated (Max) :

2.55mm

Width :

27mm

Number of Gates :

236666

Number of Terminations :

256

Peak Reflow Temperature (Cel) :

225

Number of I/O :

180

Terminal Pitch :

1.27mm

Mounting Type :

Surface Mount

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RAM Size :

7kB

Package / Case :

256-BBGA

Combinatorial Delay of a CLB-Max :

0.6 ns

Pin Count :

256

RoHS Status :

Non-RoHS Compliant

Voltage - Supply :

2.375V~2.625V

Base Part Number :

XCV200

Published :

2000

Lead Free :

Contains Lead

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

JESD-609 Code :

e0

Power Supplies :

1.2/3.62.5V

Clock Frequency :

333MHz

Supply Voltage :

2.5V

Number of Logic Elements/Cells :

5292

Length :

27mm

Operating Temperature :

0°C~85°C TJ