IRFR5505
- Mfr.Part #
- IRFR5505
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-252-3, DPak (2 Leads + Tab), SC-63
- Datasheet
- Download
- Description
- MOSFET P-CH 55V 18A DPAK
- Stock
- 162,394
- In Stock :
- 162,394
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Transistor Application :
- SWITCHING
- Additional Feature :
- AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
- Drain Current-Max (Abs) (ID) :
- 18A
- Pulsed Drain Current-Max (IDM) :
- 64A
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Terminal Finish :
- TIN LEAD
- Qualification Status :
- Not Qualified
- Avalanche Energy Rating (Eas) :
- 150 mJ
- Number of Terminations :
- 2
- RoHS Status :
- Non-RoHS Compliant
- Surface Mount :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mounting Type :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 245
- Power Dissipation-Max :
- 57W Tc
- Series :
- HEXFET®
- Operating Mode :
- ENHANCEMENT MODE
- Drain to Source Voltage (Vdss) :
- 55V
- Current - Continuous Drain (Id) @ 25°C :
- 18A Tc
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Input Capacitance (Ciss) (Max) @ Vds :
- 650pF @ 25V
- Vgs (Max) :
- ±20V
- Rds On (Max) @ Id, Vgs :
- 110m Ω @ 9.6A, 10V
- JESD-30 Code :
- R-PSSO-G2
- ECCN Code :
- EAR99
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Number of Elements :
- 1
- Packaging :
- Tube
- Gate Charge (Qg) (Max) @ Vgs :
- 32nC @ 10V
- Case Connection :
- DRAIN
- Package / Case :
- TO-252-3, DPak (2 Leads + Tab), SC-63
- Published :
- 1997
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Terminal Form :
- Gull wing
- Drain-source On Resistance-Max :
- 0.11Ohm
- Terminal Position :
- Single
- DS Breakdown Voltage-Min :
- 55V
- Transistor Element Material :
- SILICON
- JEDEC-95 Code :
- TO-252AA
- JESD-609 Code :
- e0
- Operating Temperature :
- -55°C~150°C TJ
- FET Type :
- P-Channel
- Datasheets
- IRFR5505

P-Channel Tube 110m Ω @ 9.6A, 10V ±20V 650pF @ 25V 32nC @ 10V 55V TO-252-3, DPak (2 Leads + Tab), SC-63
IRFR5505 Description
International Rectifier's Fifth Generation HEXFETs use innovative processing techniques to provide ultra-low on-resistance per silicon area. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications.
Surface mounting with vapor phase, infrared, or wave soldering processes is possible with the D-Pak. For through-hole mounting applications, the straight lead version (IRFU series) is used. In normal surface mount applications, power dissipation levels of up to 1.5 watts are conceivable.
IRFR5505 Features
-
Ultra-Low On-Resistance
-
P-Channel
-
Surface Mount (IRFR5505)
-
Straight Lead (IRFU5505)
-
Advanced Process Technology
-
Fast Switching
-
Fully Avalanche Rated
IRFR5505 Applications
-
Power Management
-
Consumer Electronics
-
Portable Devices
-
Industrial
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