IRFR2405PBF
- Mfr.Part #
- IRFR2405PBF
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-252-3, DPak (2 Leads + Tab), SC-63
- Datasheet
- Download
- Description
- MOSFET N-CH 55V 56A DPAK
- Stock
- 73,760
- In Stock :
- 73,760
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Mount :
- Surface Mount
- REACH SVHC :
- No SVHC
- Number of Elements :
- 1
- Power Dissipation-Max :
- 110W Tc
- FET Type :
- N-Channel
- Packaging :
- Tube
- Number of Pins :
- 3
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Rds On (Max) @ Id, Vgs :
- 16m Ω @ 34A, 10V
- Published :
- 2000
- Lead Free :
- Contains Lead, Lead Free
- Height :
- 2.3876mm
- Recovery Time :
- 93 ns
- Threshold Voltage :
- 4V
- Current Rating :
- 56A
- Fall Time (Typ) :
- 78 ns
- Series :
- HEXFET®
- Continuous Drain Current (ID) :
- 56A
- Termination :
- SMD/SMT
- Radiation Hardening :
- No
- Current - Continuous Drain (Id) @ 25°C :
- 56A Tc
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Width :
- 6.22mm
- RoHS Status :
- ROHS3 Compliant
- Operating Temperature :
- -55°C~175°C TJ
- Input Capacitance (Ciss) (Max) @ Vds :
- 2430pF @ 25V
- Gate Charge (Qg) (Max) @ Vgs :
- 110nC @ 10V
- Rise Time :
- 130ns
- Voltage - Rated DC :
- 55V
- ECCN Code :
- EAR99
- Package / Case :
- TO-252-3, DPak (2 Leads + Tab), SC-63
- Power Dissipation :
- 110W
- Turn On Delay Time :
- 15 ns
- Nominal Vgs :
- 4 V
- Factory Lead Time :
- 52 Weeks
- Turn-Off Delay Time :
- 55 ns
- Drain to Source Breakdown Voltage :
- 55V
- Vgs (Max) :
- ±20V
- Element Configuration :
- Single
- Length :
- 6.7056mm
- Dual Supply Voltage :
- 55V
- Mounting Type :
- Surface Mount
- Gate to Source Voltage (Vgs) :
- 20V
- Contact Plating :
- Tin
- Datasheets
- IRFR2405PBF

N-Channel Tube 16m Ω @ 34A, 10V ±20V 2430pF @ 25V 110nC @ 10V TO-252-3, DPak (2 Leads + Tab), SC-63
IRFR2405PBF Description
International Rectifier's Seventh Generation HEXFET? Power MOSFETs use cutting-edge processing methods to produce extraordinarily low on-resistance per silicon area. This feature offers the designer a highly efficient and dependable device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET power MOSFETs are widely known for.
The D-Pak is made to be surface mounted utilizing infrared, vapor phase, or wave soldering methods. For throughhole mounting applications, use the straight lead version (IRFU series). In a typical surface mount, power dissipation values of up to 1.5 watts are possible.
IRFR2405PBF Features
-
Surface Mount (IRFR2405)
-
Straight Lead (IRFU2405)
-
Advanced Process Technology
-
Dynamic dv/dt Rating
-
Fast Switching
-
Fully Avalanche Rated
-
Lead-Free
IRFR2405PBF Applications
-
Power Management
-
Consumer Electronics
-
Portable Devices
-
Industrial
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