IRFL024NPBF
- Mfr.Part #
- IRFL024NPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-261-4, TO-261AA
- Datasheet
- Download
- Description
- MOSFET N-CH 55V 2.8A SOT223
- Stock
- 20,502
- In Stock :
- 20,502
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Peak Reflow Temperature (Cel) :
- 260
- ECCN Code :
- EAR99
- Case Connection :
- DRAIN
- Current - Continuous Drain (Id) @ 25°C :
- 2.8A Ta
- Number of Terminations :
- 4
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Drain Current-Max (Abs) (ID) :
- 2.8A
- Additional Feature :
- AVALANCHE RATED
- Terminal Form :
- Gull wing
- Surface Mount :
- yes
- Rds On (Max) @ Id, Vgs :
- 75m Ω @ 2.8A, 10V
- Number of Elements :
- 1
- Mounting Type :
- Surface Mount
- Drain-source On Resistance-Max :
- 0.075Ohm
- Package / Case :
- TO-261-4, TO-261AA
- Operating Temperature :
- -55°C~150°C TJ
- Input Capacitance (Ciss) (Max) @ Vds :
- 400pF @ 25V
- Packaging :
- Tube
- Published :
- 1999
- Gate Charge (Qg) (Max) @ Vgs :
- 18.3nC @ 10V
- Series :
- HEXFET®
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Transistor Element Material :
- SILICON
- FET Type :
- N-Channel
- Terminal Position :
- Dual
- JESD-30 Code :
- R-PDSO-G4
- JESD-609 Code :
- e3
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Drain to Source Voltage (Vdss) :
- 55V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Transistor Application :
- SWITCHING
- DS Breakdown Voltage-Min :
- 55V
- Operating Mode :
- ENHANCEMENT MODE
- Reach Compliance Code :
- not_compliant
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Factory Lead Time :
- 20 Weeks
- Terminal Finish :
- Matte Tin (Sn)
- RoHS Status :
- ROHS3 Compliant
- Power Dissipation-Max :
- 1W Ta
- Qualification Status :
- Not Qualified
- Vgs (Max) :
- ±20V
- Datasheets
- IRFL024NPBF

N-Channel Tube 75m Ω @ 2.8A, 10V ±20V 400pF @ 25V 18.3nC @ 10V 55V TO-261-4, TO-261AA
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The SOT-223 package is designed for surface-mount using vapor phase, infra red, or wave soldering techniques. Its unique package design allows for easy automatic pick-and-place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of 1.0W is possible in a typical surface mount application.
IRFL024NPBF Features
Surface Mount
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
Fast Switching
Fully Avalanche Rated
Lead-Free
IRFL024NPBF Applications
Switching Applications
New Energy Vehicle
Photovoltaic Generation
Wind Power Generation
Smart Grid
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