FDZ298N
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- Mfr.Part #
- FDZ298N
- Manufacturer
- onsemi
- Package / Case
- 9-WFBGA
- Datasheet
- Download
- Description
- MOSFET N-CH 20V 6A 9BGA
- Stock
- 15,172
- In Stock ：
- 15,172
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- Manufacturer :
- onsemi
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Power Dissipation-Max :
- 1.7W Ta
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Rds On (Max) @ Id, Vgs :
- 27mOhm @ 6A, 4.5V
- Gate Charge (Qg) (Max) @ Vgs :
- 10nC @ 4.5V
- Packaging :
- Tape and Reel (TR)
- Operating Temperature :
- -55°C~150°C TJ
- Series :
- PowerTrench®
- Drain to Source Voltage (Vdss) :
- 20V
- Input Capacitance (Ciss) (Max) @ Vds :
- 680pF @ 10V
- Vgs (Max) :
- ±12V
- Current - Continuous Drain (Id) @ 25°C :
- 6A Ta
- Drive Voltage (Max Rds On,Min Rds On) :
- 2.5V 4.5V
- FET Type :
- N-Channel
- Mounting Type :
- Surface Mount
- Supplier Device Package :
- 9-BGA (1.5x1.6)
- Package / Case :
- 9-WFBGA
- Vgs(th) (Max) @ Id :
- 1.5V @ 250µA
- Published :
- 2005
- Datasheets
- FDZ298N
N-Channel Tape & Reel (TR) 27mOhm @ 6A, 4.5V ±12V 680pF @ 10V 10nC @ 4.5V 20V 9-WFBGA
FDZ298N Description
FDZ298N combines Xiantong's advanced 2.5V dedicated PowerTritch process with state-of-the-art BGA packaging to minimize PCB space and RDS (on). This BGA MOSFET represents a breakthrough in packaging technology, enabling the device to combine excellent heat transfer characteristics, high current handling capacity, ultra-low package, low gate charge and low RDS (conduction).
FDZ298N Features
? 6 A, 20 V RDS(ON) = 27 m? @ VGS = 4.5 V
RDS(ON) = 39 m? @ VGS = 2.5 V
? Occupies only 2.25 mm2 of PCB area.
Less than 50% of the area of a SSOT-6
? Ultra-thin package: less than 0.80 mm height when
mounted to PCB
? Outstanding thermal transfer characteristics:
4 times better than SSOT-6
? Ultra-low Qg x RDS(ON) figure-of-merit
? High power and current handling capability.
FDZ298N Applications
? Battery management
? Battery protection
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