CYDD18S72V18-200BBXC
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- Mfr.Part #
- CYDD18S72V18-200BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 256FBGA
- Stock
- 40,536
- In Stock ：
- 40,536
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Number of Terminations :
- 484
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V.
- Terminal Pitch :
- 1mm
- Memory Width :
- 72
- Base Part Number :
- CYDD
- Clock Frequency :
- 200MHz
- Memory Type :
- Volatile
- Peak Reflow Temperature (Cel) :
- 260
- Packaging :
- Tray
- Access Time :
- 500ps
- Number of Ports :
- 2
- JESD-609 Code :
- e1
- Number of Functions :
- 1
- Supply Voltage :
- 1.5V
- Operating Temperature :
- 0°C~70°C TA
- JESD-30 Code :
- S-PBGA-B484
- Lead Free :
- Lead Free
- Number of Pins :
- 256
- Word Size :
- 72b
- Mount :
- Surface Mount
- Package / Case :
- 256-LBGA
- Memory Size :
- 18Mb 256K x 36 x 2 256K x 72
- RoHS Status :
- ROHS3 Compliant
- Operating Supply Voltage :
- 1.8V
- Sync/Async :
- SYNCHRONOUS
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Qualification Status :
- Not Qualified
- Pin Count :
- 484
- Nominal Supply Current :
- 1.14A
- Address Bus Width :
- 36b
- Mounting Type :
- Surface Mount
- Memory Format :
- SRAM
- Published :
- 2006
- Memory Interface :
- Parallel
- Terminal Position :
- BOTTOM
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Density :
- 18 Mb
- Supply Voltage-Max (Vsup) :
- 1.58V
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Datasheets
- CYDD18S72V18-200BBXC
Memory Infineon Technologies CYDD18S72V18-200BBXC Overview
Infineon Technologies presents the CYDD18S72V18-200BBXC, an exceptional Integrated Circuit (IC) designed to meet the demanding requirements of modern memory applications. This 18MBIT Parallel SRAM, housed in a compact 256FBGA package, stands as a testament to Infineon's commitment to innovation and reliability in semiconductor technology.
With its high-speed parallel interface and robust architecture, the CYDD18S72V18-200BBXC offers unparalleled performance and stability, making it an ideal choice for applications where data integrity and access speed are paramount. Whether deployed in industrial automation, telecommunications, or embedded systems, this IC delivers consistent and dependable operation, ensuring seamless integration into diverse environments.
Infineon Technologies continues to set the standard for memory solutions, and the CYDD18S72V18-200BBXC exemplifies this dedication to excellence, empowering businesses with the tools they need to succeed in today's fast-paced digital landscape.
CYDD18S72V18-200BBXC Features
- High-Speed Parallel Interface: Facilitates rapid data transfer for efficient system performance.
- 18MBIT Capacity: Provides ample storage capacity
wideMemory Infineon Technologies CYDD range18S72V18- of applications200BBXC Overview
.The Memoryli Infineon Technologies CYDD18> S72V200BBXC is a high-capacity,256 FBGA18Mbit SRAM Package chip that offers robust performance in: a compact 256FBGA Compact package and. durable packaging ensures Designed reliability in various by operating conditions. - Infineon Technologies Quality: Backed by Infineon's reputation for excellence in semiconductor manufacturing.
CYDD18S72V18-200BBXC Applications
- Industrial Automation: The CYDD18S72V18-200BBXC enhances automation systems by providing fast and reliable access to critical data, ensuring smooth operation in manufacturing, robotics, and control applications.
- Telecommunications: In telecommunications infrastructure, this IC facilitates high-speed data processing, enabling efficient handling of voice, video, and internet traffic in network switches, routers, and base stations.
- Embedded Systems: Embedded devices benefit from the CYDD18S72V18-200BBXC's compact form factor and robust design, making it an excellent choice for applications such as automotive electronics, medical devices, and consumer electronics where space and reliability are essential.
CYDD18S72V18-200BBXC Features
This SRAM unit is equipped with 18Mbit of storage, providing ample space for high-performance computing needs. The parallel interface facilitates faster data transfer rates, which is critical for applications that demand quick access to large volumes of data. Moreover, the 256FBGA package is designed for efficient thermal management and reduced footprint on system boards, making it a preferred choice for compact systems that cannot afford to compromise on performance.
CYDD18S72V18-200BBXC Applications
- Advanced Computing Systems: Utilized in servers and high-performance computers where speed and reliability are crucial. The SRAM's rapid access time enhances overall system responsiveness.
- Networking Hardware: Deployed in routers, switches, and network controllers to manage data flow efficiently. Its high-speed memory helps in handling large bandwidths without latency.
- Automotive Electronics: Integrated into automotive control units for real-time processing and data storage, supporting advanced driver-assistance systems (ADAS).
- Industrial Automation: Used in PLCs and industrial PCs to enhance process control and machine-to-machine communication, ensuring swift and reliable operations in demanding industrial environments.
- Consumer Electronics: Applied in high-end gaming consoles and smart home devices, where quick memory access can significantly improve user experience and device functionality.
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