CYDD09S36V18-167BBXC
- Mfr.Part #
- CYDD09S36V18-167BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 256FBGA
- Stock
- 40,545
- In Stock :
- 40,545
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Output Characteristics :
- 3-STATE
- Pbfree Code :
- yes
- Pin Count :
- 256
- Address Bus Width :
- 34b
- Mount :
- Surface Mount
- Sync/Async :
- SYNCHRONOUS
- Terminal Position :
- BOTTOM
- Access Time :
- 600ps
- Supply Voltage-Max (Vsup) :
- 1.58V
- Packaging :
- Tray
- JESD-609 Code :
- e1
- Clock Frequency :
- 167MHz
- Memory Width :
- 72
- Standby Voltage-Min :
- 1.5V
- Number of Functions :
- 1
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Height Seated (Max) :
- 1.7mm
- Radiation Hardening :
- No
- Lead Free :
- Lead Free
- Density :
- 9 Mb
- Memory Size :
- 9Mb 128K x 36 x 2
- Number of Ports :
- 2
- Word Size :
- 36b
- Memory Type :
- Volatile
- Base Part Number :
- CYDD
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Package / Case :
- 256-LBGA
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mounting Type :
- Surface Mount
- Published :
- 2006
- Terminal Pitch :
- 1mm
- Operating Supply Voltage :
- 1.8V
- Memory Format :
- SRAM
- Operating Temperature :
- 0°C~70°C TA
- Peak Reflow Temperature (Cel) :
- 260
- RoHS Status :
- ROHS3 Compliant
- Memory Interface :
- Parallel
- Supply Voltage :
- 1.5V
- Length :
- 17mm
- I/O Type :
- COMMON
- Nominal Supply Current :
- 560mA
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Number of Pins :
- 256
- Number of Terminations :
- 256
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V
- Datasheets
- CYDD09S36V18-167BBXC

Memory Infineon Technologies CYDD09S36V18-167BBXC Overview
The Memory Infineon Technologies CYDD09S36V18-167BBXC is a high-performance 9Mbit SRAM chip designed for applications requiring rapid access and storage of large amounts of data. Manufactured by Infineon Technologies, this IC leverages advanced fabrication techniques to provide exceptional reliability and speed, encapsulated in a compact 256FBGA package. It is engineered to support the rigorous demands of high-speed data environments, making it ideal for a wide range of industrial and commercial applications. The integration of this memory component into your systems ensures minimal latency, enhanced throughput, and increased efficiency in data processing tasks, critical for systems requiring fast and reliable memory solutions.
CYDD09S36V18-167BBXC Features
This SRAM component boasts several features that make it stand out in the competitive memory chip market. It offers a large 9MB storage capacity within a parallel interface structure, ensuring swift data access and manipulation. The 256FBGA packaging not only provides robust protection but also ensures optimal thermal management and space efficiency in circuit designs. Moreover, its compatibility with various standard operating voltages and temperatures makes it versatile for integration into diverse hardware configurations.
CYDD09S36V18-167BBXC Applications
- Networking Equipment: Used in routers and switches to enhance packet buffer management, ensuring efficient data flow and reduced latency in network communications.
- High-performance Computing: Serves as cache memory in servers and workstations, improving processing speed and responsiveness in complex computational tasks.
- Aerospace and Defense: Deployed in avionics for real-time data processing and storage, crucial for mission-critical applications requiring robust, fail-safe memory.
- Automotive: Utilized in advanced driver-assistance systems (ADAS) to temporarily store sensor data, aiding in real-time decision making and vehicle automation.
- Telecommunications: Employs in telecommunications infrastructure to manage real-time voice and video data streams, optimizing signal integrity and service quality.
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