CYDD18S72V18-167BBXC
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- Mfr.Part #
- CYDD18S72V18-167BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 256FBGA
- Stock
- 39,112
- In Stock ：
- 39,112
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Nominal Supply Current :
- 980mA
- Terminal Position :
- BOTTOM
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V.
- Supply Voltage :
- 1.5V
- Number of Functions :
- 1
- Supply Voltage-Max (Vsup) :
- 1.58V
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Pin Count :
- 484
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Terminal Pitch :
- 1mm
- Published :
- 2006
- Operating Supply Voltage :
- 1.8V
- Memory Interface :
- Parallel
- Base Part Number :
- CYDD
- Memory Width :
- 72
- Package / Case :
- 256-LBGA
- Memory Size :
- 18Mb 256K x 36 x 2 256K x 72
- Memory Format :
- SRAM
- Number of Ports :
- 2
- RoHS Status :
- ROHS3 Compliant
- JESD-30 Code :
- S-PBGA-B484
- Number of Terminations :
- 484
- Word Size :
- 72b
- Lead Free :
- Lead Free
- Operating Temperature :
- 0°C~70°C TA
- Sync/Async :
- SYNCHRONOUS
- Mount :
- Surface Mount
- Clock Frequency :
- 167MHz
- Number of Pins :
- 256
- JESD-609 Code :
- e1
- Memory Type :
- Volatile
- Qualification Status :
- Not Qualified
- Peak Reflow Temperature (Cel) :
- 260
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Mounting Type :
- Surface Mount
- Density :
- 18 Mb
- Address Bus Width :
- 36b
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Packaging :
- Tray
- Access Time :
- 600ps
- Datasheets
- CYDD18S72V18-167BBXC
Memory Infineon Technologies CYDD18S72V18-167BBXC Overview
The Memory Infineon Technologies CYDD18S72V18-167BBXC is an advanced 18Mbit SRAM component designed for high-performance data buffering in computing and telecommunications infrastructure. With its high-speed parallel interface and a compact 256FBGA package, this memory module ensures reliable, rapid access to data, critical for modern high-speed applications. Its robust storage capacity and efficient architecture make it ideal for systems requiring fast and durable memory solutions, particularly in sectors demanding prolonged service life and operational stability.
CYDD18S72V18-167BBXC Features
This IC SRAM module features 18Mbit of storage, provided in a high-density 256FBGA package that optimizes board space and enhances thermal performance. The parallel interface facilitates quick data transfer rates that are essential for high-throughput applications, ensuring minimal latency and increased system efficiency. Designed by Infineon Technologies, a leader in semiconductor solutions, the CYDD18S72V18-167BBXC guarantees high reliability and performance under a wide range of environmental conditions.
CYDD18S72V18-167BBXC Applications
- High-Performance Computing: Utilizes its rapid data access capabilities to manage large-scale computations and data analysis efficiently.
- Networking Equipment: Enhances the performance of routers and switches by providing high-speed buffering of data packets, ensuring efficient network traffic management.
- Telecommunications Systems: Critical for use in telecommunications infrastructure, where quick data retrieval is necessary for signal processing and real-time communication.
- Industrial Automation: Supports reliable and quick data management in industrial control systems, crucial for real-time monitoring and control.
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Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
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