CYDD18S72V18-167BBXC
- Mfr.Part #
- CYDD18S72V18-167BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 256FBGA
- Stock
- 39,112
- In Stock :
- 39,112
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Address Bus Width :
- 36b
- Memory Size :
- 18Mb 256K x 36 x 2 256K x 72
- Pin Count :
- 484
- Terminal Position :
- BOTTOM
- Memory Width :
- 72
- JESD-609 Code :
- e1
- Operating Supply Voltage :
- 1.8V
- Mount :
- Surface Mount
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V.
- Peak Reflow Temperature (Cel) :
- 260
- JESD-30 Code :
- S-PBGA-B484
- Published :
- 2006
- Clock Frequency :
- 167MHz
- Supply Voltage :
- 1.5V
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Memory Format :
- SRAM
- Nominal Supply Current :
- 980mA
- Supply Voltage-Max (Vsup) :
- 1.58V
- Package / Case :
- 256-LBGA
- Number of Terminations :
- 484
- Base Part Number :
- CYDD
- Terminal Pitch :
- 1mm
- Sync/Async :
- SYNCHRONOUS
- Qualification Status :
- Not Qualified
- Number of Ports :
- 2
- Word Size :
- 72b
- Access Time :
- 600ps
- Lead Free :
- Lead Free
- Density :
- 18 Mb
- Memory Interface :
- Parallel
- Operating Temperature :
- 0°C~70°C TA
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Number of Functions :
- 1
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Memory Type :
- Volatile
- Number of Pins :
- 256
- Packaging :
- Tray
- Datasheets
- CYDD18S72V18-167BBXC

Memory Infineon Technologies CYDD18S72V18-167BBXC Overview
The Memory Infineon Technologies CYDD18S72V18-167BBXC is an advanced 18Mbit SRAM component designed for high-performance data buffering in computing and telecommunications infrastructure. With its high-speed parallel interface and a compact 256FBGA package, this memory module ensures reliable, rapid access to data, critical for modern high-speed applications. Its robust storage capacity and efficient architecture make it ideal for systems requiring fast and durable memory solutions, particularly in sectors demanding prolonged service life and operational stability.
CYDD18S72V18-167BBXC Features
This IC SRAM module features 18Mbit of storage, provided in a high-density 256FBGA package that optimizes board space and enhances thermal performance. The parallel interface facilitates quick data transfer rates that are essential for high-throughput applications, ensuring minimal latency and increased system efficiency. Designed by Infineon Technologies, a leader in semiconductor solutions, the CYDD18S72V18-167BBXC guarantees high reliability and performance under a wide range of environmental conditions.
CYDD18S72V18-167BBXC Applications
- High-Performance Computing: Utilizes its rapid data access capabilities to manage large-scale computations and data analysis efficiently.
- Networking Equipment: Enhances the performance of routers and switches by providing high-speed buffering of data packets, ensuring efficient network traffic management.
- Telecommunications Systems: Critical for use in telecommunications infrastructure, where quick data retrieval is necessary for signal processing and real-time communication.
- Industrial Automation: Supports reliable and quick data management in industrial control systems, crucial for real-time monitoring and control.
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