CYDD18S72V18-167BBXC

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Mfr.Part #
CYDD18S72V18-167BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 256FBGA
Stock
39,112
In Stock :
39,112

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Address Bus Width :
36b
Memory Size :
18Mb 256K x 36 x 2 256K x 72
Pin Count :
484
Terminal Position :
BOTTOM
Memory Width :
72
JESD-609 Code :
e1
Operating Supply Voltage :
1.8V
Mount :
Surface Mount
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V.
Peak Reflow Temperature (Cel) :
260
JESD-30 Code :
S-PBGA-B484
Published :
2006
Clock Frequency :
167MHz
Supply Voltage :
1.5V
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Memory Format :
SRAM
Nominal Supply Current :
980mA
Supply Voltage-Max (Vsup) :
1.58V
Package / Case :
256-LBGA
Number of Terminations :
484
Base Part Number :
CYDD
Terminal Pitch :
1mm
Sync/Async :
SYNCHRONOUS
Qualification Status :
Not Qualified
Number of Ports :
2
Word Size :
72b
Access Time :
600ps
Lead Free :
Lead Free
Density :
18 Mb
Memory Interface :
Parallel
Operating Temperature :
0°C~70°C TA
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
5 (48 Hours)
Time@Peak Reflow Temperature-Max (s) :
40
Number of Functions :
1
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Memory Type :
Volatile
Number of Pins :
256
Packaging :
Tray
Introducing Memory Infineon Technologies CYDD18S72V18-167BBXC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Number of Terminations:484, Base Part Number:CYDD, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Number of Pins:256, CYDD18S72V18-167BBXC pinout, CYDD18S72V18-167BBXC datasheet PDF, CYDD18S72V18-167BBXC amp .Beyond Memory Infineon Technologies CYDD18S72V18-167BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYDD18S72V18-167BBXC


Memory Infineon Technologies CYDD18S72V18-167BBXC Overview

The Memory Infineon Technologies CYDD18S72V18-167BBXC is an advanced 18Mbit SRAM component designed for high-performance data buffering in computing and telecommunications infrastructure. With its high-speed parallel interface and a compact 256FBGA package, this memory module ensures reliable, rapid access to data, critical for modern high-speed applications. Its robust storage capacity and efficient architecture make it ideal for systems requiring fast and durable memory solutions, particularly in sectors demanding prolonged service life and operational stability.

CYDD18S72V18-167BBXC Features

This IC SRAM module features 18Mbit of storage, provided in a high-density 256FBGA package that optimizes board space and enhances thermal performance. The parallel interface facilitates quick data transfer rates that are essential for high-throughput applications, ensuring minimal latency and increased system efficiency. Designed by Infineon Technologies, a leader in semiconductor solutions, the CYDD18S72V18-167BBXC guarantees high reliability and performance under a wide range of environmental conditions.

CYDD18S72V18-167BBXC Applications

  • High-Performance Computing: Utilizes its rapid data access capabilities to manage large-scale computations and data analysis efficiently.
  • Networking Equipment: Enhances the performance of routers and switches by providing high-speed buffering of data packets, ensuring efficient network traffic management.
  • Telecommunications Systems: Critical for use in telecommunications infrastructure, where quick data retrieval is necessary for signal processing and real-time communication.
  • Industrial Automation: Supports reliable and quick data management in industrial control systems, crucial for real-time monitoring and control.
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