CYDD18S72V18-167BBXC

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Mfr.Part #
CYDD18S72V18-167BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 256FBGA
Stock
39,112
In Stock :
39,112

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Memory Type :
Volatile
Terminal Position :
BOTTOM
Number of Pins :
256
Clock Frequency :
167MHz
Memory Interface :
Parallel
Mount :
Surface Mount
RoHS Status :
ROHS3 Compliant
Operating Supply Voltage :
1.8V
Number of Terminations :
484
Memory Size :
18Mb 256K x 36 x 2 256K x 72
JESD-30 Code :
S-PBGA-B484
Number of Functions :
1
Packaging :
Tray
Peak Reflow Temperature (Cel) :
260
JESD-609 Code :
e1
Time@Peak Reflow Temperature-Max (s) :
40
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Moisture Sensitivity Level (MSL) :
5 (48 Hours)
Density :
18 Mb
Memory Format :
SRAM
Address Bus Width :
36b
Qualification Status :
Not Qualified
Base Part Number :
CYDD
Sync/Async :
SYNCHRONOUS
Supply Voltage :
1.5V
Operating Temperature :
0°C~70°C TA
Pin Count :
484
Number of Ports :
2
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V.
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Nominal Supply Current :
980mA
Mounting Type :
Surface Mount
Package / Case :
256-LBGA
Published :
2006
Memory Width :
72
Lead Free :
Lead Free
Word Size :
72b
Access Time :
600ps
Terminal Pitch :
1mm
Supply Voltage-Max (Vsup) :
1.58V
Introducing Memory Infineon Technologies CYDD18S72V18-167BBXC from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:256, Number of Terminations:484, Base Part Number:CYDD, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Package / Case:256-LBGA, CYDD18S72V18-167BBXC pinout, CYDD18S72V18-167BBXC datasheet PDF, CYDD18S72V18-167BBXC amp .Beyond Memory Infineon Technologies CYDD18S72V18-167BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYDD18S72V18-167BBXC


Memory Infineon Technologies CYDD18S72V18-167BBXC Overview

The Memory Infineon Technologies CYDD18S72V18-167BBXC is an advanced 18Mbit SRAM component designed for high-performance data buffering in computing and telecommunications infrastructure. With its high-speed parallel interface and a compact 256FBGA package, this memory module ensures reliable, rapid access to data, critical for modern high-speed applications. Its robust storage capacity and efficient architecture make it ideal for systems requiring fast and durable memory solutions, particularly in sectors demanding prolonged service life and operational stability.

CYDD18S72V18-167BBXC Features

This IC SRAM module features 18Mbit of storage, provided in a high-density 256FBGA package that optimizes board space and enhances thermal performance. The parallel interface facilitates quick data transfer rates that are essential for high-throughput applications, ensuring minimal latency and increased system efficiency. Designed by Infineon Technologies, a leader in semiconductor solutions, the CYDD18S72V18-167BBXC guarantees high reliability and performance under a wide range of environmental conditions.

CYDD18S72V18-167BBXC Applications

  • High-Performance Computing: Utilizes its rapid data access capabilities to manage large-scale computations and data analysis efficiently.
  • Networking Equipment: Enhances the performance of routers and switches by providing high-speed buffering of data packets, ensuring efficient network traffic management.
  • Telecommunications Systems: Critical for use in telecommunications infrastructure, where quick data retrieval is necessary for signal processing and real-time communication.
  • Industrial Automation: Supports reliable and quick data management in industrial control systems, crucial for real-time monitoring and control.
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