CYDD18S36V18-167BBXC
- Mfr.Part #
- CYDD18S36V18-167BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 256FBGA
- Stock
- 5,873
- In Stock :
- 5,873
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Operating Temperature :
- 0°C~70°C TA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Surface Mount :
- yes
- RoHS Status :
- ROHS3 Compliant
- Operating Supply Voltage :
- 1.8V
- Access Time :
- 600ps
- Lead Free :
- Lead Free
- Base Part Number :
- CYDD
- Supply Current-Max :
- 0.88mA
- Memory Type :
- Volatile
- Memory Size :
- 18Mb 256K x 36 x 2
- Address Bus Width :
- 18b
- Standby Current-Max :
- 0.3A
- Number of Terminations :
- 256
- Pin Count :
- 256
- Supply Voltage-Max (Vsup) :
- 1.58V
- Packaging :
- Tray
- Output Characteristics :
- 3-STATE
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Memory Interface :
- Parallel
- Pbfree Code :
- yes
- Number of Pins :
- 256
- Memory Width :
- 72
- I/O Type :
- COMMON
- Clock Frequency :
- 167MHz
- Height Seated (Max) :
- 1.7mm
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Terminal Pitch :
- 1mm
- Memory Format :
- SRAM
- Peak Reflow Temperature (Cel) :
- 260
- Supply Voltage :
- 1.5V
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Package / Case :
- 256-LBGA
- Length :
- 19mm
- JESD-609 Code :
- e1
- Standby Voltage-Min :
- 1.5V
- Density :
- 18 Mb
- Terminal Position :
- BOTTOM
- Number of Ports :
- 2
- Published :
- 2006
- Mounting Type :
- Surface Mount
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V
- Number of Functions :
- 1
- Radiation Hardening :
- No
- Datasheets
- CYDD18S36V18-167BBXC

Memory Infineon Technologies CYDD18S36V18-167BBXC Overview
The Memory Infineon Technologies CYDD18S36V18-167BBXC is a high-performance IC SRAM with an impressive storage capacity of 18Mbit, designed to meet the rigorous demands of sophisticated electronic systems. This SRAM chip, encased in a 256FBGA package, offers a reliable and robust storage solution that ensures quick access and stability across a wide range of operating conditions. Aimed at B2B clients looking to integrate cutting-edge technology into their products, the CYDD18S36V18-167BBXC delivers unparalleled reliability and performance that Infineon Technologies is renowned for. The compact form factor and parallel interface ensure seamless integration into various applications, making it an ideal choice for manufacturers aiming to enhance system performance with minimal latency.
CYDD18S36V18-167BBXC Features
This IC SRAM features a parallel interface that allows for quick and efficient data handling, enabling high-speed operations critical in modern electronics. The 18Mbit capacity is substantial for applications requiring swift access to large volumes of data without sacrificing space or power efficiency. The use of a 256FBGA package ensures reduced physical footprint while enhancing thermal stability and overall reliability.
CYDD18S36V18-167BBXC Applications
- Networking Equipment: Utilized in routers and switches for buffering data, ensuring efficient data flow and minimizing packet loss.
- High-performance Computing: Serves as fast-access scratchpad memory in servers and supercomputers, facilitating rapid data retrieval and processing.
- Embedded Systems: Integral for real-time applications in automotive and industrial control systems, where quick data access is crucial.
- Telecommunications: Employed in telecom infrastructure to manage real-time voice and data transmission efficiently.
- Gaming Consoles: Enhances gaming performance by providing quick access to frequently used data, thereby reducing load times and improving user experience.
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