CYDD09S36V18-200BBXC
- Mfr.Part #
- CYDD09S36V18-200BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 256FBGA
- Stock
- 1,411
- In Stock :
- 1,411
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Sync/Async :
- SYNCHRONOUS
- Memory Format :
- SRAM
- Supply Voltage-Max (Vsup) :
- 1.58V
- Package / Case :
- 256-LBGA
- Mounting Type :
- Surface Mount
- Output Characteristics :
- 3-STATE
- Access Time :
- 500ps
- Terminal Pitch :
- 1mm
- Nominal Supply Current :
- 790mA
- Memory Width :
- 72
- JESD-609 Code :
- e1
- Density :
- 9 Mb
- Word Size :
- 36b
- Length :
- 17mm
- Operating Temperature :
- 0°C~70°C TA
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Operating Supply Voltage :
- 1.8V
- Memory Size :
- 9Mb 128K x 36 x 2
- Packaging :
- Tray
- Address Bus Width :
- 34b
- Mount :
- Surface Mount
- Terminal Position :
- BOTTOM
- Radiation Hardening :
- No
- Memory Interface :
- Parallel
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V
- Clock Frequency :
- 200MHz
- Number of Pins :
- 256
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Peak Reflow Temperature (Cel) :
- 260
- Pbfree Code :
- yes
- Factory Lead Time :
- 12 Weeks
- I/O Type :
- COMMON
- Number of Functions :
- 1
- RoHS Status :
- ROHS3 Compliant
- Published :
- 2006
- Pin Count :
- 256
- Number of Terminations :
- 256
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Lead Free :
- Lead Free
- Memory Type :
- Volatile
- Base Part Number :
- CYDD
- Standby Voltage-Min :
- 1.5V
- Height Seated (Max) :
- 1.7mm
- Number of Ports :
- 2
- Supply Voltage :
- 1.5V
- Datasheets
- CYDD09S36V18-200BBXC

Memory Infineon Technologies CYDD09S36V18-200BBXC Overview
Introducing the Infineon Technologies CYDD09S36V18-200BBXC, a state-of-the-art Integrated Circuit (IC) that brings robustness and high performance to the forefront of memory solutions. This IC is designed for high-speed and high-density applications, featuring a substantial 9Mbit SRAM capacity and a compact 256FBGA package. Ideal for systems requiring fast access and reliable storage, the Memory Infineon Technologies CYDD09S36V18-200BBXC integrates seamlessly into a variety of advanced digital environments, ensuring minimal latency and maximal reliability. Its architectural efficiency is tailored to meet the rigorous demands of both contemporary and future-focused applications.
CYDD09S36V18-200BBXC Features
The CYDD09S36V18-200BBXC excels in delivering top-notch performance and versatility. Key features include a large 9MBIT SRAM, high-speed parallel interface for quick data access and processing, and a thermally efficient 256FBGA packaging. This IC is engineered to perform reliably in intensive operational conditions, making it an ideal choice for sophisticated electronics that require durable and fast memory solutions.
CYDD09S36V18-200BBXC Applications
- Telecommunications Equipment: Utilized for buffering and data retention in switches and routers, enhancing performance and reliability in high-speed communication networks.
- Industrial Automation Systems: Serves as reliable data storage in control systems, facilitating fast system responses and higher throughput in automated manufacturing processes.
- Automotive Electronics: Integral for advanced driver-assistance systems (ADAS) where quick data access is crucial for real-time decision-making and vehicle operation safety.
- Consumer Electronics: Used in high-performance gaming consoles and computers, improving user experience through enhanced processing speed and stability.
- Medical Devices: Supports critical applications in medical imaging systems, such as MRIs and CT scanners, ensuring swift data handling and precision in diagnostics.
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