CYDD09S36V18-200BBXC

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Mfr.Part #
CYDD09S36V18-200BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 256FBGA
Stock
1,411
In Stock :
1,411

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Mount :
Surface Mount
Address Bus Width :
34b
Published :
2006
Operating Supply Voltage :
1.8V
I/O Type :
COMMON
Memory Type :
Volatile
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Pbfree Code :
yes
Supply Voltage :
1.5V
Lead Free :
Lead Free
Memory Width :
72
Supply Voltage-Max (Vsup) :
1.58V
Package / Case :
256-LBGA
Number of Functions :
1
Terminal Position :
BOTTOM
Factory Lead Time :
12 Weeks
Word Size :
36b
Density :
9 Mb
Pin Count :
256
Memory Size :
9Mb 128K x 36 x 2
Clock Frequency :
200MHz
Radiation Hardening :
No
Packaging :
Tray
Memory Interface :
Parallel
Nominal Supply Current :
790mA
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
260
Length :
17mm
Number of Ports :
2
Moisture Sensitivity Level (MSL) :
5 (48 Hours)
Base Part Number :
CYDD
JESD-609 Code :
e1
Mounting Type :
Surface Mount
Output Characteristics :
3-STATE
Sync/Async :
SYNCHRONOUS
Operating Temperature :
0°C~70°C TA
Number of Pins :
256
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) :
30
Standby Voltage-Min :
1.5V
Access Time :
500ps
Terminal Pitch :
1mm
Memory Format :
SRAM
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V
Height Seated (Max) :
1.7mm
Number of Terminations :
256
Introducing Memory Infineon Technologies CYDD09S36V18-200BBXC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Base Part Number:CYDD, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Number of Pins:256, Number of Terminations:256, CYDD09S36V18-200BBXC pinout, CYDD09S36V18-200BBXC datasheet PDF, CYDD09S36V18-200BBXC amp .Beyond Memory Infineon Technologies CYDD09S36V18-200BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYDD09S36V18-200BBXC


Memory Infineon Technologies CYDD09S36V18-200BBXC Overview

Introducing the Infineon Technologies CYDD09S36V18-200BBXC, a state-of-the-art Integrated Circuit (IC) that brings robustness and high performance to the forefront of memory solutions. This IC is designed for high-speed and high-density applications, featuring a substantial 9Mbit SRAM capacity and a compact 256FBGA package. Ideal for systems requiring fast access and reliable storage, the Memory Infineon Technologies CYDD09S36V18-200BBXC integrates seamlessly into a variety of advanced digital environments, ensuring minimal latency and maximal reliability. Its architectural efficiency is tailored to meet the rigorous demands of both contemporary and future-focused applications.

CYDD09S36V18-200BBXC Features

The CYDD09S36V18-200BBXC excels in delivering top-notch performance and versatility. Key features include a large 9MBIT SRAM, high-speed parallel interface for quick data access and processing, and a thermally efficient 256FBGA packaging. This IC is engineered to perform reliably in intensive operational conditions, making it an ideal choice for sophisticated electronics that require durable and fast memory solutions.

CYDD09S36V18-200BBXC Applications

  • Telecommunications Equipment: Utilized for buffering and data retention in switches and routers, enhancing performance and reliability in high-speed communication networks.
  • Industrial Automation Systems: Serves as reliable data storage in control systems, facilitating fast system responses and higher throughput in automated manufacturing processes.
  • Automotive Electronics: Integral for advanced driver-assistance systems (ADAS) where quick data access is crucial for real-time decision-making and vehicle operation safety.
  • Consumer Electronics: Used in high-performance gaming consoles and computers, improving user experience through enhanced processing speed and stability.
  • Medical Devices: Supports critical applications in medical imaging systems, such as MRIs and CT scanners, ensuring swift data handling and precision in diagnostics.
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