CYDD18S36V18-200BBXC

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Mfr.Part #
CYDD18S36V18-200BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 256FBGA
Stock
48,255
In Stock :
48,255

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Length :
19mm
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Lead Free :
Lead Free
Pin Count :
256
Number of Pins :
256
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Supply Current-Max :
0.98mA
Terminal Position :
BOTTOM
Clock Frequency :
200MHz
Memory Interface :
Parallel
Memory Type :
Volatile
Standby Voltage-Min :
1.5V
Surface Mount :
yes
RoHS Status :
ROHS3 Compliant
Radiation Hardening :
No
Output Characteristics :
3-STATE
Memory Width :
72
I/O Type :
COMMON
Base Part Number :
CYDD
Number of Functions :
1
Density :
18 Mb
Access Time :
500ps
Supply Voltage-Max (Vsup) :
1.58V
Time@Peak Reflow Temperature-Max (s) :
20
Number of Ports :
2
Packaging :
Tray
Memory Size :
18Mb 256K x 36 x 2
Mounting Type :
Surface Mount
Standby Current-Max :
0.3A
Peak Reflow Temperature (Cel) :
260
Supply Voltage :
1.5V
Address Bus Width :
18b
Number of Terminations :
256
JESD-609 Code :
e1
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V
Published :
2006
Operating Supply Voltage :
1.8V
Pbfree Code :
yes
Operating Temperature :
0°C~70°C TA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
SRAM
Height Seated (Max) :
1.7mm
Terminal Pitch :
1mm
Package / Case :
256-LBGA
Introducing Memory Infineon Technologies CYDD18S36V18-200BBXC from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:256, Base Part Number:CYDD, Mounting Type:Surface Mount, Number of Terminations:256, Operating Temperature:0°C~70°C TA, Package / Case:256-LBGA, CYDD18S36V18-200BBXC pinout, CYDD18S36V18-200BBXC datasheet PDF, CYDD18S36V18-200BBXC amp .Beyond Memory Infineon Technologies CYDD18S36V18-200BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYDD18S36V18-200BBXC


Memory Infineon Technologies CYDD18S36V18-200BBXC Overview

Introducing the Memory Infineon Technologies CYDD18S36V18-200BBXC, a high-performance 18Mbit SRAM component from Infineon Technologies, designed for applications demanding high-speed data access and reliability. This IC leverages advanced circuit design and leading-edge technology, encapsulated in a 256FBGA package, offering robust parallel interface options for seamless integration. This product is ideal for enterprises seeking scalable solutions in high-speed computing environments, ensuring both efficiency and longevity in system performance.

CYDD18S36V18-200BBXC Features

This SRAM unit boasts several key features that make it a standout choice for integrating into advanced electronic systems. Its 18Mbit storage capacity allows for substantial data handling capabilities, while the parallel interface facilitates faster data transfer rates, essential for real-time processing applications. The compact 256FBGA packaging not only ensures a reduced footprint but also enhances thermal stability and improves overall durability.

CYDD18S36V18-200BBXC Applications

  • Networking Equipment: Utilized in routers and switches for buffer and caching functions, enhancing data flow and reducing latency.
  • Telecommunications: Plays a critical role in telecom infrastructures by storing firmware and other critical data for fast access, improving service reliability and speed.
  • Industrial Automation: Supports complex industrial control systems by providing quick access to data, essential for real-time decision making and process control.
  • Medical Devices: Used in medical imaging systems to handle large datasets effectively, ensuring rapid processing and response times essential in medical diagnostics.
  • High-performance Computing: Ideal for applications requiring quick data retrieval to support intensive computational tasks in scientific and financial modeling.
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