CYD36S72V18-200BGXC
- Mfr.Part #
- CYD36S72V18-200BGXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 484-FBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 484FBGA
- Stock
- 3,521
- In Stock :
- 3,521
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Surface Mount
- Qualification Status :
- COMMERCIAL
- Memory Width :
- 72
- Supply Voltage-Min (Vsup) :
- 1.42V
- Memory Format :
- SRAM
- JESD-30 Code :
- S-PBGA-B484
- Reach Compliance Code :
- Unknown
- Packaging :
- Tray
- Height Seated (Max) :
- 2.46mm
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
- Terminal Finish :
- TIN SILVER COPPER
- Width :
- 27mm
- Memory Type :
- Volatile
- Organization :
- 512KX72
- Access Time :
- 3.3ns
- Terminal Pitch :
- 1mm
- Memory Size :
- 36Mb 512K x 72
- Supply Voltage-Max (Vsup) :
- 1.58V
- Clock Frequency :
- 200MHz
- Surface Mount :
- yes
- JESD-609 Code :
- e1
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Number of Terminations :
- 484
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Memory Interface :
- Parallel
- Supply Voltage :
- 1.5V
- Terminal Position :
- BOTTOM
- Pbfree Code :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Density :
- 37748736 bit
- Number of Functions :
- 1
- Operating Temperature :
- 0°C~70°C TA
- Length :
- 27mm
- Package / Case :
- 484-FBGA
- Peak Reflow Temperature (Cel) :
- 260
- Pin Count :
- 484
- Datasheets
- CYD36S72V18-200BGXC
CYD36S72V18-200BGXC Documents

Memory Infineon Technologies CYD36S72V18-200BGXC Overview
The Memory Infineon Technologies CYD36S72V18-200BGXC represents a cutting-edge solution in high-density SRAM technology, designed to meet the rigorous demands of high-speed computing and advanced networking systems. This 36Mbit SRAM chip, housed in a compact 484-ball fine pitch ball grid array (FBGA) package, ensures robust performance with its parallel interface, facilitating quick and efficient data retrieval and storage. This component is ideal for applications requiring high bandwidth and low latency memory access, making it an indispensable part of modern electronic systems.
CYD36S72V18-200BGXC Features
This SRAM module features a high data storage capacity of 36Mbit, combined with a parallel interface that enhances data processing speeds essential for high-performance computing environments. The 484FBGA package not only minimizes the footprint on circuit boards but also enhances thermal stability and reliability. The device's design and architecture are tailored for efficient integration into sophisticated electronic assemblies, offering enhanced durability and operational efficiency.
CYD36S72V18-200BGXC Applications
- Networking Equipment: Utilized in routers and switches, this SRAM can handle high-speed data buffering, which is crucial for managing large volumes of network traffic efficiently.
- Telecommunications: In telecom infrastructure, the CYD36S72V18-200BGXC supports fast access times required for high-performance signal processing, aiding in faster communication and data transfer.
- High-performance Computing: Ideal for use in servers and supercomputers where rapid access to large amounts of data is necessary for processing complex computations and simulations.
- Industrial Automation: Supports the demands of automation systems for quick data logging and real-time system response, enhancing operational efficiency and reliability.
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Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
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