CYD36S72V18-200BGXC

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Mfr.Part #
CYD36S72V18-200BGXC
Manufacturer
Infineon Technologies
Package / Case
484-FBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 484FBGA
Stock
3,521
In Stock :
3,521

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Mounting Type :
Surface Mount
Terminal Finish :
TIN SILVER COPPER
RoHS Status :
ROHS3 Compliant
Package / Case :
484-FBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage-Min (Vsup) :
1.42V
Memory Interface :
Parallel
Memory Density :
37748736 bit
Clock Frequency :
200MHz
Memory Type :
Volatile
Operating Temperature :
0°C~70°C TA
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Peak Reflow Temperature (Cel) :
260
Length :
27mm
Access Time :
3.3ns
Number of Functions :
1
Number of Terminations :
484
Pin Count :
484
JESD-609 Code :
e1
Terminal Pitch :
1mm
Width :
27mm
Qualification Status :
COMMERCIAL
Pbfree Code :
yes
Time@Peak Reflow Temperature-Max (s) :
20
Memory Format :
SRAM
Supply Voltage-Max (Vsup) :
1.58V
Reach Compliance Code :
Unknown
Height Seated (Max) :
2.46mm
Memory Width :
72
JESD-30 Code :
S-PBGA-B484
Terminal Position :
BOTTOM
Packaging :
Tray
Supply Voltage :
1.5V
Organization :
512KX72
Surface Mount :
yes
Memory Size :
36Mb 512K x 72
Introducing Memory Infineon Technologies CYD36S72V18-200BGXC from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:484-FBGA, Operating Temperature:0°C~70°C TA, Number of Terminations:484, CYD36S72V18-200BGXC pinout, CYD36S72V18-200BGXC datasheet PDF, CYD36S72V18-200BGXC amp .Beyond Memory Infineon Technologies CYD36S72V18-200BGXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD36S72V18-200BGXC


Memory Infineon Technologies CYD36S72V18-200BGXC Overview

The Memory Infineon Technologies CYD36S72V18-200BGXC represents a cutting-edge solution in high-density SRAM technology, designed to meet the rigorous demands of high-speed computing and advanced networking systems. This 36Mbit SRAM chip, housed in a compact 484-ball fine pitch ball grid array (FBGA) package, ensures robust performance with its parallel interface, facilitating quick and efficient data retrieval and storage. This component is ideal for applications requiring high bandwidth and low latency memory access, making it an indispensable part of modern electronic systems.

CYD36S72V18-200BGXC Features

This SRAM module features a high data storage capacity of 36Mbit, combined with a parallel interface that enhances data processing speeds essential for high-performance computing environments. The 484FBGA package not only minimizes the footprint on circuit boards but also enhances thermal stability and reliability. The device's design and architecture are tailored for efficient integration into sophisticated electronic assemblies, offering enhanced durability and operational efficiency.

CYD36S72V18-200BGXC Applications

  • Networking Equipment: Utilized in routers and switches, this SRAM can handle high-speed data buffering, which is crucial for managing large volumes of network traffic efficiently.
  • Telecommunications: In telecom infrastructure, the CYD36S72V18-200BGXC supports fast access times required for high-performance signal processing, aiding in faster communication and data transfer.
  • High-performance Computing: Ideal for use in servers and supercomputers where rapid access to large amounts of data is necessary for processing complex computations and simulations.
  • Industrial Automation: Supports the demands of automation systems for quick data logging and real-time system response, enhancing operational efficiency and reliability.
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Shipping Cost

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