CYD36S36V18-200BGXC

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Mfr.Part #
CYD36S36V18-200BGXC
Manufacturer
Infineon Technologies
Package / Case
484-FBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 484FBGA
Stock
32,957
In Stock :
32,957

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Mounting Type :
Surface Mount
Terminal Finish :
TIN SILVER COPPER
Organization :
1MX36
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Height Seated (Max) :
2.46mm
Memory Type :
Volatile
Memory Width :
36
Memory Size :
36Mb 1M x 36
Terminal Position :
BOTTOM
Time@Peak Reflow Temperature-Max (s) :
20
Number of Terminations :
484
Reach Compliance Code :
Unknown
Supply Voltage-Max (Vsup) :
1.58V
Memory Density :
37748736 bit
Width :
27mm
Clock Frequency :
200MHz
Supply Voltage :
1.5V
Length :
27mm
Memory Interface :
Parallel
Number of Functions :
1
Pbfree Code :
yes
Memory Format :
SRAM
Package / Case :
484-FBGA
Access Time :
3.3ns
JESD-609 Code :
e1
Terminal Pitch :
1mm
JESD-30 Code :
S-PBGA-B484
Pin Count :
484
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Operating Temperature :
0°C~70°C TA
Qualification Status :
COMMERCIAL
Packaging :
Tray
Supply Voltage-Min (Vsup) :
1.42V
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
260
RoHS Status :
ROHS3 Compliant
Introducing Memory Infineon Technologies CYD36S36V18-200BGXC from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:484, Package / Case:484-FBGA, Operating Temperature:0°C~70°C TA, CYD36S36V18-200BGXC pinout, CYD36S36V18-200BGXC datasheet PDF, CYD36S36V18-200BGXC amp .Beyond Memory Infineon Technologies CYD36S36V18-200BGXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD36S36V18-200BGXC


Memory Infineon Technologies CYD36S36V18-200BGXC Overview

The Memory Infineon Technologies CYD36S36V18-200BGXC SRAM chip from Infineon Technologies stands out in the high-performance memory sector. Designed to deliver exceptional speed and reliability, this 36Mbit SRAM uses a parallel interface encapsulated in a 484FBGA package, ensuring compactness and ease of integration into sophisticated systems. Ideal for applications demanding high-speed data access and storage, this product caters to the needs of advanced computing and digital signal processing environments. Its robust build and cutting-edge technology make it a preferred choice for designers looking to enhance system performance while maintaining energy efficiency.

CYD36S36V18-200BGXC Features

The CYD36S36V18-200BGXC SRAM features include a large 36Mbit capacity and a parallel interface for rapid data access and throughput. Housed in a 484-pin fine-pitch Ball Grid Array (FBGA) package, it offers excellent reliability and durability under a wide range of environmental conditions. This SRAM's high data integrity and low power consumption make it suitable for demanding electronic applications where performance and operational efficiency are critical.

CYD36S36V18-200BGXC Applications

  • Advanced Computing Systems: Integrates seamlessly into server and workstation architectures, providing fast access to buffer, cache, and other temporary storage needs.
  • Telecommunications Equipment: Used in switches and routers for quick data buffering, enhancing the efficiency and speed of data transmission networks.
  • Aerospace and Defense: Supports high reliability and speed requirements for applications in avionics and military technology, where data integrity and system robustness are paramount.
  • Medical Imaging Devices: Facilitates the processing and storage of large amounts of data quickly in advanced medical imaging equipment such as MRI and CT scanners.
  • Industrial Automation: Empowers complex industrial machinery with the ability to handle intricate tasks through rapid access to control data, improving operational accuracy and speed.
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