CYD36S36V18-200BGXC
- Mfr.Part #
- CYD36S36V18-200BGXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 484-FBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 484FBGA
- Stock
- 32,957
- In Stock :
- 32,957
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Mounting Type :
- Surface Mount
- Terminal Finish :
- TIN SILVER COPPER
- Organization :
- 1MX36
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Height Seated (Max) :
- 2.46mm
- Memory Type :
- Volatile
- Memory Width :
- 36
- Memory Size :
- 36Mb 1M x 36
- Terminal Position :
- BOTTOM
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Number of Terminations :
- 484
- Reach Compliance Code :
- Unknown
- Supply Voltage-Max (Vsup) :
- 1.58V
- Memory Density :
- 37748736 bit
- Width :
- 27mm
- Clock Frequency :
- 200MHz
- Supply Voltage :
- 1.5V
- Length :
- 27mm
- Memory Interface :
- Parallel
- Number of Functions :
- 1
- Pbfree Code :
- yes
- Memory Format :
- SRAM
- Package / Case :
- 484-FBGA
- Access Time :
- 3.3ns
- JESD-609 Code :
- e1
- Terminal Pitch :
- 1mm
- JESD-30 Code :
- S-PBGA-B484
- Pin Count :
- 484
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
- Operating Temperature :
- 0°C~70°C TA
- Qualification Status :
- COMMERCIAL
- Packaging :
- Tray
- Supply Voltage-Min (Vsup) :
- 1.42V
- Surface Mount :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Peak Reflow Temperature (Cel) :
- 260
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- CYD36S36V18-200BGXC

Memory Infineon Technologies CYD36S36V18-200BGXC Overview
The Memory Infineon Technologies CYD36S36V18-200BGXC SRAM chip from Infineon Technologies stands out in the high-performance memory sector. Designed to deliver exceptional speed and reliability, this 36Mbit SRAM uses a parallel interface encapsulated in a 484FBGA package, ensuring compactness and ease of integration into sophisticated systems. Ideal for applications demanding high-speed data access and storage, this product caters to the needs of advanced computing and digital signal processing environments. Its robust build and cutting-edge technology make it a preferred choice for designers looking to enhance system performance while maintaining energy efficiency.
CYD36S36V18-200BGXC Features
The CYD36S36V18-200BGXC SRAM features include a large 36Mbit capacity and a parallel interface for rapid data access and throughput. Housed in a 484-pin fine-pitch Ball Grid Array (FBGA) package, it offers excellent reliability and durability under a wide range of environmental conditions. This SRAM's high data integrity and low power consumption make it suitable for demanding electronic applications where performance and operational efficiency are critical.
CYD36S36V18-200BGXC Applications
- Advanced Computing Systems: Integrates seamlessly into server and workstation architectures, providing fast access to buffer, cache, and other temporary storage needs.
- Telecommunications Equipment: Used in switches and routers for quick data buffering, enhancing the efficiency and speed of data transmission networks.
- Aerospace and Defense: Supports high reliability and speed requirements for applications in avionics and military technology, where data integrity and system robustness are paramount.
- Medical Imaging Devices: Facilitates the processing and storage of large amounts of data quickly in advanced medical imaging equipment such as MRI and CT scanners.
- Industrial Automation: Empowers complex industrial machinery with the ability to handle intricate tasks through rapid access to control data, improving operational accuracy and speed.
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Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
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