CYD36S36V18-167BGXC

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Mfr.Part #
CYD36S36V18-167BGXC
Manufacturer
Infineon Technologies
Package / Case
484-FBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 484FBGA
Stock
17,130
In Stock :
17,130

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Manufacturer :
Infineon Technologies
Product Category :
Memory
RoHS Status :
ROHS3 Compliant
I/O Type :
COMMON
Word Size :
36b
Time@Peak Reflow Temperature-Max (s) :
20
Operating Supply Voltage :
1.8V
Memory Size :
36Mb 1M x 36
Output Characteristics :
3-STATE
Memory Interface :
Parallel
Peak Reflow Temperature (Cel) :
260
Supply Voltage-Max (Vsup) :
1.58V
JESD-609 Code :
e1
Memory Width :
36
Terminal Position :
BOTTOM
Pbfree Code :
yes
Address Bus Width :
20b
Memory Type :
Volatile
Mount :
Surface Mount
Memory Format :
SRAM
Base Part Number :
CYD36S36
Pin Count :
484
Standby Current-Max :
0.59A
Clock Frequency :
167MHz
Access Time :
4ns
Number of Functions :
1
Terminal Pitch :
1mm
Operating Temperature :
0°C~70°C TA
Number of Pins :
484
Number of Ports :
2
Published :
2011
Standby Voltage-Min :
1.4V
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
484-FBGA
Supply Voltage :
1.5V
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Sync/Async :
SYNCHRONOUS
Radiation Hardening :
No
Organization :
1MX36
Nominal Supply Current :
1.35A
Density :
36 Mb
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Packaging :
Tray
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Number of Terminations :
484
Introducing Memory Infineon Technologies CYD36S36V18-167BGXC from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:CYD36S36, Operating Temperature:0°C~70°C TA, Number of Pins:484, Mounting Type:Surface Mount, Package / Case:484-FBGA, Number of Terminations:484, CYD36S36V18-167BGXC pinout, CYD36S36V18-167BGXC datasheet PDF, CYD36S36V18-167BGXC amp .Beyond Memory Infineon Technologies CYD36S36V18-167BGXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD36S36V18-167BGXC


Memory Infineon Technologies CYD36S36V18-167BGXC Overview

Introducing the Memory Infineon Technologies CYD36S36V18-167BGXC, a high-performance IC SRAM designed to meet the rigorous demands of advanced computing systems. Manufactured by Infineon Technologies, this 36Mbit SRAM features a parallel interface encapsulated in a 484-ball FBGA package, ensuring robustness and high-speed data retention. Engineered for applications requiring rapid access and large storage capacity, this SRAM chip excels in delivering top-notch performance while maintaining energy efficiency. Its compact form factor and parallel configuration make it an ideal solution for enhancing the capability of sophisticated electronic systems.

CYD36S36V18-167BGXC Features

The CYD36S36V18-167BGXC boasts several key features that set it apart in the field of high-capacity memory solutions. Notably, it provides a substantial 36Mbit of storage, ample for demanding applications. Its parallel interface assures high-speed data transfer rates, which are crucial for systems requiring swift access to large volumes of data. The 484FBGA packaging not only offers a compact and efficient layout but also enhances the overall durability and reliability of the module. This design ensures optimal performance in a wide range of operating conditions.

CYD36S36V18-167BGXC Applications

  • Networking Equipment: Utilized in routers and switches to enhance data buffering and speed up packet processing.
  • High-Performance Computing: Plays a crucial role in data caching for supercomputers and advanced computing nodes, facilitating faster access to frequently used data.
  • Automotive Systems: Applied in advanced driver-assistance systems (ADAS) to manage data quickly and efficiently, improving response times and reliability in critical situations.
  • Industrial Automation: Used in control systems where fast data retrieval is necessary to ensure seamless and efficient industrial operations.
  • Telecommunications: Supports telecommunications infrastructure by providing high-speed data storage and access for network management and signal processing tasks.
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