CYD36S36V18-167BGXC
- Mfr.Part #
- CYD36S36V18-167BGXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 484-FBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 484FBGA
- Stock
- 17,130
- In Stock :
- 17,130
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- RoHS Status :
- ROHS3 Compliant
- I/O Type :
- COMMON
- Word Size :
- 36b
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Operating Supply Voltage :
- 1.8V
- Memory Size :
- 36Mb 1M x 36
- Output Characteristics :
- 3-STATE
- Memory Interface :
- Parallel
- Peak Reflow Temperature (Cel) :
- 260
- Supply Voltage-Max (Vsup) :
- 1.58V
- JESD-609 Code :
- e1
- Memory Width :
- 36
- Terminal Position :
- BOTTOM
- Pbfree Code :
- yes
- Address Bus Width :
- 20b
- Memory Type :
- Volatile
- Mount :
- Surface Mount
- Memory Format :
- SRAM
- Base Part Number :
- CYD36S36
- Pin Count :
- 484
- Standby Current-Max :
- 0.59A
- Clock Frequency :
- 167MHz
- Access Time :
- 4ns
- Number of Functions :
- 1
- Terminal Pitch :
- 1mm
- Operating Temperature :
- 0°C~70°C TA
- Number of Pins :
- 484
- Number of Ports :
- 2
- Published :
- 2011
- Standby Voltage-Min :
- 1.4V
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 484-FBGA
- Supply Voltage :
- 1.5V
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
- Sync/Async :
- SYNCHRONOUS
- Radiation Hardening :
- No
- Organization :
- 1MX36
- Nominal Supply Current :
- 1.35A
- Density :
- 36 Mb
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Packaging :
- Tray
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Number of Terminations :
- 484
- Datasheets
- CYD36S36V18-167BGXC
CYD36S36V18-167BGXC Documents

Memory Infineon Technologies CYD36S36V18-167BGXC Overview
Introducing the Memory Infineon Technologies CYD36S36V18-167BGXC, a high-performance IC SRAM designed to meet the rigorous demands of advanced computing systems. Manufactured by Infineon Technologies, this 36Mbit SRAM features a parallel interface encapsulated in a 484-ball FBGA package, ensuring robustness and high-speed data retention. Engineered for applications requiring rapid access and large storage capacity, this SRAM chip excels in delivering top-notch performance while maintaining energy efficiency. Its compact form factor and parallel configuration make it an ideal solution for enhancing the capability of sophisticated electronic systems.
CYD36S36V18-167BGXC Features
The CYD36S36V18-167BGXC boasts several key features that set it apart in the field of high-capacity memory solutions. Notably, it provides a substantial 36Mbit of storage, ample for demanding applications. Its parallel interface assures high-speed data transfer rates, which are crucial for systems requiring swift access to large volumes of data. The 484FBGA packaging not only offers a compact and efficient layout but also enhances the overall durability and reliability of the module. This design ensures optimal performance in a wide range of operating conditions.
CYD36S36V18-167BGXC Applications
- Networking Equipment: Utilized in routers and switches to enhance data buffering and speed up packet processing.
- High-Performance Computing: Plays a crucial role in data caching for supercomputers and advanced computing nodes, facilitating faster access to frequently used data.
- Automotive Systems: Applied in advanced driver-assistance systems (ADAS) to manage data quickly and efficiently, improving response times and reliability in critical situations.
- Industrial Automation: Used in control systems where fast data retrieval is necessary to ensure seamless and efficient industrial operations.
- Telecommunications: Supports telecommunications infrastructure by providing high-speed data storage and access for network management and signal processing tasks.
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