CYD36S72V18-167BGXC

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Mfr.Part #
CYD36S72V18-167BGXC
Manufacturer
Infineon Technologies
Package / Case
484-FBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 484FBGA
Stock
29,259
In Stock :
29,259

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Mount :
Surface Mount
Number of Ports :
2
Terminal Position :
BOTTOM
Terminal Pitch :
1mm
Memory Format :
SRAM
Word Size :
72b
Number of Functions :
1
Number of Pins :
484
Memory Width :
72
I/O Type :
COMMON
Memory Type :
Volatile
Nominal Supply Current :
1.62A
Pin Count :
484
Sync/Async :
SYNCHRONOUS
Access Time :
4ns
Supply Voltage :
1.5V
Density :
36 Mb
Qualification Status :
Not Qualified
Peak Reflow Temperature (Cel) :
260
Mounting Type :
Surface Mount
Reach Compliance Code :
Unknown
Supply Voltage-Max (Vsup) :
1.58V
Memory Size :
36Mb 512K x 72
Memory Interface :
Parallel
Packaging :
Tray
Output Characteristics :
3-STATE
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Clock Frequency :
167MHz
Operating Supply Voltage :
1.8V
Standby Voltage-Min :
1.4V
Time@Peak Reflow Temperature-Max (s) :
20
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Number of Terminations :
484
Standby Current-Max :
0.59A
RoHS Status :
ROHS3 Compliant
JESD-609 Code :
e1
Address Bus Width :
38b
Base Part Number :
CYD36S72
Operating Temperature :
0°C~70°C TA
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Package / Case :
484-FBGA
Datasheets
CYD36S72V18-167BGXC
Introducing Memory Infineon Technologies CYD36S72V18-167BGXC from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:484, Mounting Type:Surface Mount, Number of Terminations:484, Base Part Number:CYD36S72, Operating Temperature:0°C~70°C TA, Package / Case:484-FBGA, CYD36S72V18-167BGXC pinout, CYD36S72V18-167BGXC datasheet PDF, CYD36S72V18-167BGXC amp .Beyond Memory Infineon Technologies CYD36S72V18-167BGXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD36S72V18-167BGXC


Memory Infineon Technologies CYD36S72V18-167BGXC Overview

The Memory Infineon Technologies CYD36S72V18-167BGXC represents a high-performance, 36Mbit SRAM device, packaged in a compact 484-ball fine pitch ball grid array (FBGA). This integrated circuit is designed by Infineon Technologies, a leader in semiconductor innovation, to provide fast, reliable, and efficient data storage and retrieval solutions for advanced computing and networking systems. Engineered to support high-speed parallel interfaces, this memory chip excels in applications requiring quick access and high bandwidth, making it an ideal choice for a variety of demanding environments.

CYD36S72V18-167BGXC Features

  • Capacity: 36Mbit of storage space allows for efficient data management in complex systems.
  • Package: Housed in a 484FBGA, ensuring robust performance in a compact footprint.
  • Interface: Parallel interface supports high-speed data transmission.
  • Speed: Fast access time enhances overall system responsiveness and throughput.

CYD36S72V18-167BGXC Applications

  • Advanced Networking Equipment: Utilized in routers and switches to enhance buffer memory capabilities and improve data flow management.
  • High-Performance Computing: Supports computing clusters by providing rapid access memory, essential for reducing latency in intensive computational tasks.
  • Telecommunications: Applied in telecommunications infrastructure to store and manage large volumes of data efficiently, crucial for real-time communication systems.
  • Video Streaming Devices: Ensures smooth data caching and retrieval in video streaming devices, aiding in buffering and playback of high-definition video content.
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