CYD36S36V18-167BGXI
- Mfr.Part #
- CYD36S36V18-167BGXI
- Manufacturer
- Infineon Technologies
- Package / Case
- 484-FBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 484FBGA
- Stock
- 43,406
- In Stock :
- 43,406
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Pbfree Code :
- yes
- Number of Ports :
- 2
- Number of Pins :
- 484
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage :
- 1.5V
- JESD-609 Code :
- e1
- Number of Terminations :
- 484
- Memory Size :
- 36Mb 1M x 36
- Output Characteristics :
- 3-STATE
- Sync/Async :
- SYNCHRONOUS
- Memory Width :
- 36
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Pitch :
- 1mm
- Operating Supply Voltage :
- 1.8V
- Organization :
- 1MX36
- Memory Interface :
- Parallel
- Terminal Position :
- BOTTOM
- RoHS Status :
- ROHS3 Compliant
- Pin Count :
- 484
- Memory Type :
- Volatile
- Clock Frequency :
- 167MHz
- Standby Voltage-Min :
- 1.4V
- Number of Functions :
- 1
- Nominal Supply Current :
- 1.47A
- Package / Case :
- 484-FBGA
- Published :
- 2011
- Factory Lead Time :
- 15 Weeks
- Word Size :
- 36b
- Access Time :
- 4ns
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Base Part Number :
- CYD36S36
- Density :
- 36 Mb
- Supply Voltage-Max (Vsup) :
- 1.58V
- I/O Type :
- COMMON
- Memory Format :
- SRAM
- Radiation Hardening :
- No
- Operating Temperature :
- -40°C~85°C TA
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Additional Feature :
- PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
- Lead Free :
- Lead Free
- Standby Current-Max :
- 0.7A
- Address Bus Width :
- 20b
- Packaging :
- Tray
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Datasheets
- CYD36S36V18-167BGXI

Memory Infineon Technologies CYD36S36V18-167BGXI Overview
The Memory Infineon Technologies CYD36S36V18-167BGXI is a high-performance 36Mbit SRAM component, encapsulated in a 484FBGA package, designed by Infineon Technologies. This product combines advanced parallel interface technology with a dense memory layout, making it ideal for applications that require fast access and high reliability. This memory module is engineered to support demanding industrial and enterprise-level applications, ensuring robust performance under varying operational conditions. With its significant storage capacity and compact form factor, this SRAM is specifically crafted to meet the sophisticated needs of modern technology systems, thereby facilitating enhanced system efficiency and reliability.
CYD36S36V18-167BGXI Features
The CYD36S36V18-167BGXI SRAM features a parallel interface, offering high-speed data access and processing capabilities. Its 484FBGA packaging not only provides a protective and robust enclosure but also aids in efficient heat dissipation, essential for maintaining stability and performance under high operational loads. Additionally, the 36Mbit capacity allows for substantial data storage, making it suitable for complex processing tasks in advanced computing environments.
CYD36S36V18-167BGXI Applications
- Networking Equipment: Utilized in routers and switches to manage and store routing tables efficiently, enabling quicker data packet processing and improved network traffic management.
- Telecommunications: Essential for telecom systems, where fast and reliable data access is necessary for signal processing and real-time communication services.
- Industrial Automation: Plays a critical role in automation systems, facilitating the high-speed operation of machine control units and real-time processing of sensor data.
- Medical Devices: Used in various medical imaging and diagnostic equipment, providing the necessary speed and reliability for processing large amounts of patient data.
- Aerospace and Defense: Ideal for applications in aerospace systems, where extreme conditions demand robust and reliable memory solutions for data logging and system control tasks.
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