BUP213

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Mfr.Part #
BUP213
Manufacturer
Infineon Technologies
Package / Case
TO-220-3
Datasheet
Download
Description
IGBT 1200V 32A 200W TO220
Stock
14,191
In Stock :
14,191

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Manufacturer :
Infineon Technologies
Product Category :
Transistors - IGBTs - Single
Vce(on) (Max) @ Vge, Ic :
3.2V @ 15V, 15A
Gate-Emitter Voltage-Max :
20V
Additional Feature :
High Speed
Number of Elements :
1
Test Condition :
600V, 15A, 82 Ω, 15V
Published :
2002
Number of Pins :
3
Voltage - Collector Emitter Breakdown (Max) :
1200V
Td (on/off) @ 25°C :
70ns/400ns
Polarity/Channel Type :
N-Channel
Mounting Type :
Through Hole
Package / Case :
TO-220-3
Element Configuration :
Single
Pin Count :
3
JEDEC-95 Code :
TO-220AB
Fall Time-Max (tf) :
95ns
Input Type :
Standard
Power - Max :
200W
Gate-Emitter Thr Voltage-Max :
6.5V
Max Collector Current :
32A
Mount :
Through Hole
Operating Temperature :
-55°C~150°C TJ
Terminal Finish :
MATTE TIN
Current - Collector Pulsed (Icm) :
64A
RoHS Status :
Non-RoHS Compliant
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Collector Emitter Breakdown Voltage :
1.2kV
Max Power Dissipation :
200W
Collector Emitter Voltage (VCEO) :
1.2kV
Turn On Time :
70 ns
Transistor Element Material :
SILICON
JESD-609 Code :
e3
Qualification Status :
Not Qualified
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Rise Time :
70ns
Number of Terminations :
3
Turn Off Time-Nom (toff) :
400 ns
Transistor Application :
Motor Control
ECCN Code :
EAR99
Packaging :
Tube
Datasheets
BUP213
Introducing Transistors - IGBTs - Single Infineon Technologies BUP213 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:3, Mounting Type:Through Hole, Package / Case:TO-220-3, Operating Temperature:-55°C~150°C TJ, Number of Terminations:3, BUP213 pinout, BUP213 datasheet PDF, BUP213 amp .Beyond Transistors - IGBTs - Single Infineon Technologies BUP213 ,we also offer IXYT25N250CHV, IXYX140N120A4, IXYH30N450HV, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies BUP213


BUP213 datasheet pdf and Transistors - IGBTs - Single product details from Infineon Technologies stock available at

BUP213 Description


  For a 600 V reverse voltage IGBT BUP213  , the wafer thickness required is about 100 microns, which is a huge technical challenge in manufacturing. To this end, the concept of the Treaty on the non-Proliferation of Nuclear weapons and its advantages have so far been limited to categories above 1000V. 100um Wafer-- A milestone towards 600V NPT-IGBT

 

BUP213 Features


· 1200V NPT technology

· positive temperature coefficient

· easy paralleling

 

BUP213 Applications

· drives

 



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