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  6. A2F060M3E-FG256M
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    A2F060M3E-FG256M

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    Mfr.Part #
    A2F060M3E-FG256M
    Manufacturer
    Microsemi
    Package / Case
    256-LBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-M3 80MHZ 256FBGA
    Stock
    48,329
    In Stock ：
    48,329

    Request A Quote(RFQ)

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    Manufacturer :
    Microsemi
    Product Category :
    System On Chip (SoC)
    Min Operating Temperature :
    -55°C
    Base Part Number :
    A2F060M3E
    Operating Temperature :
    -55°C~125°C TJ
    Peripherals :
    DMA, POR, WDT
    Package / Case :
    256-LBGA
    Number of I/O :
    MCU - 26, FPGA - 66
    RAM Size :
    16kB
    Number of Pins :
    256
    Frequency :
    80MHz
    Core Processor :
    ARM® Cortex®-M3
    Interface :
    EBI/EMI, I2C, SPI, UART, USART
    Primary Attributes :
    ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
    Max Operating Temperature :
    125°C
    Supplier Device Package :
    256-FPBGA (17x17)
    Series :
    SmartFusion®
    Packaging :
    Tray
    Core Architecture :
    ARM
    Speed :
    80MHz
    RoHS Status :
    Non-RoHS Compliant
    Flash Size :
    128kB
    Connectivity :
    EBI/EMI, I2C, SPI, UART/USART
    Architecture :
    MCU, FPGA
    Moisture Sensitivity Level (MSL) :
    3 (168 Hours)
    Datasheets
    A2F060M3E-FG256M
    Introducing System On Chip (SoC) Microsemi A2F060M3E-FG256M from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number：A2F060M3E, Operating Temperature：-55°C~125°C TJ, Package / Case：256-LBGA, Number of Pins：256, A2F060M3E-FG256M pinout, A2F060M3E-FG256M datasheet PDF, A2F060M3E-FG256M amp .Beyond System On Chip (SoC) Microsemi A2F060M3E-FG256M ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    Microsemi A2F060M3E-FG256M


    -55°C~125°C TJ 256 Pin A2F060M3E System On Chip SmartFusion® Series MCU - 26, FPGA - 66 I/O

    This SoC is built on ARM® Cortex®-M3 core processor(s).


    ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 256-LBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 16KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion® series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -55°C~125°C TJ.Taking note of the fact that this SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has MCU - 26, FPGA - 66 I/Os.A flashing 128KB appears on it.Searching A2F060M3E will bring up system on chips with similar specs and purposes.At 80MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 256-pin version.The SoC computing will start only if -55°C is set.This SoC system on chip is designed to operate at a temperature of 125°C.

    ARM® Cortex®-M3 processor.


    16KB RAM.
    Built on MCU, FPGA.
    128KB extended flash.
    Core Architecture: ARM


    There are a lot of Microsemi Corporation


    A2F060M3E-FG256M System On Chip (SoC) applications.


    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
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