A2F060M3E-1FG256

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Mfr.Part #
A2F060M3E-1FG256
Manufacturer
Microsemi
Package / Case
256-LBGA
Datasheet
Download
Description
IC SOC CORTEX-M3 100MHZ 256FBGA
Stock
18,383
In Stock :
18,383

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Manufacturer :
Microsemi
Product Category :
System On Chip (SoC)
Number of Registers :
1536
Packaging :
Tray
Connectivity :
EBI/EMI, I2C, SPI, UART/USART
RAM Size :
16kB
Core Architecture :
ARM
Base Part Number :
A2F060M3E
Series :
SmartFusion®
Primary Attributes :
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size :
128kB
Operating Supply Voltage :
1.5V
Interface :
EBI/EMI, I2C, SPI, UART, USART
Speed Grade :
1
Core Processor :
ARM® Cortex®-M3
Supplier Device Package :
256-FPBGA (17x17)
Speed :
100MHz
Package / Case :
256-LBGA
Number of Logic Blocks (LABs) :
8
Radiation Hardening :
No
Number of Pins :
256
Architecture :
MCU, FPGA
Frequency :
100MHz
RoHS Status :
Non-RoHS Compliant
Operating Temperature :
0°C~85°C TJ
Min Operating Temperature :
0°C
Max Frequency :
100MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
MCU - 26, FPGA - 66
Peripherals :
DMA, POR, WDT
Max Operating Temperature :
85°C
Published :
2009
Datasheets
A2F060M3E-1FG256
Introducing System On Chip (SoC) Microsemi A2F060M3E-1FG256 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:A2F060M3E, Package / Case:256-LBGA, Number of Pins:256, Operating Temperature:0°C~85°C TJ, A2F060M3E-1FG256 pinout, A2F060M3E-1FG256 datasheet PDF, A2F060M3E-1FG256 amp .Beyond System On Chip (SoC) Microsemi A2F060M3E-1FG256 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi A2F060M3E-1FG256


0°C~85°C TJ 256 Pin A2F060M3E System On Chip SmartFusion® Series MCU - 26, FPGA - 66 I/O

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 256-LBGA.With 16KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion® is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 26, FPGA - 66 I/Os are available in this SoC part.The flash size of the SoC meaning is 128KB.A search for A2F060M3E will result in system on chips that have similar specs and purposes.A frequency of 100MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC is available in 256-pin form.Just 0°C is needed to get the SoC computing up and running.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 85°C.

ARM® Cortex®-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F060M3E-1FG256 System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
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