A2F060M3E-1FGG256

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Mfr.Part #
A2F060M3E-1FGG256
Manufacturer
Microsemi
Package / Case
256-LBGA
Datasheet
Download
Description
IC SOC CORTEX-M3 100MHZ 256FBGA
Stock
24,835
In Stock :
24,835

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Manufacturer :
Microsemi
Product Category :
System On Chip (SoC)
Package / Case :
256-LBGA
RAM Size :
16kB
Interface :
EBI/EMI, I2C, SPI, UART, USART
Min Operating Temperature :
0°C
Number of Logic Blocks (LABs) :
8
Number of I/O :
MCU - 26, FPGA - 66
Peripherals :
DMA, POR, WDT
Supplier Device Package :
256-FPBGA (17x17)
Primary Attributes :
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Supply Voltage :
1.5V
Core Architecture :
ARM
Flash Size :
128kB
Max Frequency :
100MHz
Frequency :
100MHz
Series :
SmartFusion®
Base Part Number :
A2F060M3E
Architecture :
MCU, FPGA
Connectivity :
EBI/EMI, I2C, SPI, UART/USART
Min Supply Voltage :
1.425V
Max Supply Voltage :
1.575V
Number of Pins :
256
Core Processor :
ARM® Cortex®-M3
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Max Operating Temperature :
85°C
Speed :
100MHz
Operating Temperature :
0°C~85°C TJ
RoHS Status :
RoHS Compliant
Datasheets
A2F060M3E-1FGG256
Introducing System On Chip (SoC) Microsemi A2F060M3E-1FGG256 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Base Part Number:A2F060M3E, Number of Pins:256, Operating Temperature:0°C~85°C TJ, A2F060M3E-1FGG256 pinout, A2F060M3E-1FGG256 datasheet PDF, A2F060M3E-1FGG256 amp .Beyond System On Chip (SoC) Microsemi A2F060M3E-1FGG256 ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi A2F060M3E-1FGG256


0°C~85°C TJ 256 Pin A2F060M3E System On Chip SmartFusion® Series MCU - 26, FPGA - 66 I/O Min 1.425V V Max 1.575V V

This SoC is built on ARM® Cortex®-M3 core processor(s).


There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 256-LBGA by the manufacturer.As this SoC chip has 16KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion® series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of MCU - 26, FPGA - 66 I/Os.The flash is set to 128KB.By searching A2F060M3E, you can find system on chips with similar specs and purposes.There is 100MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.256 pins are present on this computer SoC.It is just enough to start the SoC computing at 0°C.As designed, this SoC system on chip can operate at a maximum temperature of 85°C.Voltage of maximum supply is 1.575V.The SoC security is powered at least by 1.425V.

ARM® Cortex®-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F060M3E-1FGG256 System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
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