A2F060M3E-1FGG256I
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- Mfr.Part #
- A2F060M3E-1FGG256I
- Manufacturer
- Microsemi
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 100MHZ 256FBGA
- Stock
- 19,868
- In Stock ：
- 19,868
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- Manufacturer :
- Microsemi
- Product Category :
- System On Chip (SoC)
- Number of Outputs :
- 66
- Core Architecture :
- ARM
- Interface :
- EBI/EMI, I2C, SPI, UART, USART
- Supply Voltage :
- 1.5V
- Terminal Pitch :
- 1mm
- Number of Equivalent Gates :
- 60000
- RAM Size :
- 16kB
- Terminal Position :
- BOTTOM
- Number of Logic Blocks (LABs) :
- 8
- Connectivity :
- EBI/EMI, I2C, SPI, UART/USART
- Terminal Form :
- Ball
- Core Processor :
- ARM® Cortex®-M3
- Architecture :
- MCU, FPGA
- Frequency :
- 100MHz
- Peak Reflow Temperature (Cel) :
- 250
- RoHS Status :
- RoHS Compliant
- Width :
- 17mm
- Number of Pins :
- 256
- JESD-609 Code :
- e1
- Flash Size :
- 128kB
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Published :
- 2015
- Peripherals :
- DMA, POR, WDT
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Surface Mount :
- yes
- Number of I/O :
- MCU - 26, FPGA - 66
- Packaging :
- Tray
- Base Part Number :
- A2F060M3E
- Series :
- SmartFusion®
- Operating Temperature :
- -40°C~100°C TJ
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage-Max (Vsup) :
- 1.575V
- Primary Attributes :
- ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
- Number of Terminations :
- 256
- Height Seated (Max) :
- 1.7mm
- Package / Case :
- 256-LBGA
- Supply Voltage-Min (Vsup) :
- 1.425V
- Organization :
- 1536 CLBS, 60000 GATES
- Length :
- 17mm
- Datasheets
- A2F060M3E-1FGG256I
256 Terminations -40°C~100°C TJ 256 Pin A2F060M3E System On Chip SmartFusion® Series MCU - 26, FPGA - 66 I/O 1.5V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 256-LBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 16KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion® is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of MCU - 26, FPGA - 66 I/Os in total.A power supply with a 1.5V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.575V.As a minimum, the power supply of the SoC system on a chip needs to be 1.425V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 256 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 66 outputs.This flash has a size of 128KB.A2F060M3E can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 100MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.This is the version with 256 pins.
ARM® Cortex®-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-1FGG256I System On Chip (SoC) applications.
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
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