A2F060M3E-1FG256I
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- Mfr.Part #
- A2F060M3E-1FG256I
- Manufacturer
- Microsemi
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 100MHZ 256FBGA
- Stock
- 15,911
- In Stock ：
- 15,911
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- Manufacturer :
- Microsemi
- Product Category :
- System On Chip (SoC)
- RAM Size :
- 16kB
- Peripherals :
- DMA, POR, WDT
- Connectivity :
- EBI/EMI, I2C, SPI, UART/USART
- Surface Mount :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Core Architecture :
- ARM
- Peak Reflow Temperature (Cel) :
- 225
- Supply Voltage :
- 1.5V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of I/O :
- MCU - 26, FPGA - 66
- Packaging :
- Tray
- Primary Attributes :
- ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
- Speed Grade :
- 1
- Package / Case :
- 256-LBGA
- Terminal Position :
- BOTTOM
- Terminal Form :
- Ball
- Radiation Hardening :
- No
- Number of Equivalent Gates :
- 60000
- Number of Outputs :
- 66
- Operating Supply Voltage :
- 1.5V
- Number of Logic Blocks (LABs) :
- 8
- JESD-609 Code :
- e0
- Frequency :
- 100MHz
- Interface :
- EBI/EMI, I2C, SPI, UART, USART
- Base Part Number :
- A2F060M3E
- Series :
- SmartFusion®
- Architecture :
- MCU, FPGA
- Flash Size :
- 128kB
- Number of Pins :
- 256
- Number of Registers :
- 1536
- RoHS Status :
- Non-RoHS Compliant
- Core Processor :
- ARM® Cortex®-M3
- Operating Temperature :
- -40°C~100°C TJ
- Number of Terminations :
- 256
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Published :
- 2009
- Datasheets
- A2F060M3E-1FG256I
256 Terminations -40°C~100°C TJ 256 Pin A2F060M3E System On Chip SmartFusion® Series MCU - 26, FPGA - 66 I/O 1.5V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 256-LBGA package as per the manufacturer's specifications.A SoC chip with 16KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion® series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of MCU - 26, FPGA - 66 I/Os.For safe operation, it is advisable to utilize a power supply with 1.5V voltage.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 256 terminations in total.In order for this SoC chip to work properly, you can have 66 outputs.As for its flash size, it is 128KB.By searching A2F060M3E, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 100MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.In this computer SoC, there are 256 pins.
ARM® Cortex®-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-1FG256I System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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