A2F060M3E-1FGG256M

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Mfr.Part #
A2F060M3E-1FGG256M
Manufacturer
Microsemi
Package / Case
256-LBGA
Datasheet
Download
Description
IC SOC CORTEX-M3 100MHZ 256FBGA
Stock
30,517
In Stock :
30,517

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Manufacturer :
Microsemi
Product Category :
System On Chip (SoC)
Connectivity :
EBI/EMI, I2C, SPI, UART/USART
RAM Size :
16kB
Core Processor :
ARM® Cortex®-M3
Package / Case :
256-LBGA
RoHS Status :
RoHS Compliant
Packaging :
Tray
Core Architecture :
ARM
Speed :
100MHz
Base Part Number :
A2F060M3E
Architecture :
MCU, FPGA
Flash Size :
128kB
Supplier Device Package :
256-FPBGA (17x17)
Interface :
EBI/EMI, I2C, SPI, UART, USART
Max Operating Temperature :
125°C
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
MCU - 26, FPGA - 66
Frequency :
100MHz
Peripherals :
DMA, POR, WDT
Primary Attributes :
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature :
-55°C~125°C TJ
Min Operating Temperature :
-55°C
Number of Pins :
256
Series :
SmartFusion®
Introducing System On Chip (SoC) Microsemi A2F060M3E-1FGG256M from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Base Part Number:A2F060M3E, Operating Temperature:-55°C~125°C TJ, Number of Pins:256, A2F060M3E-1FGG256M pinout, A2F060M3E-1FGG256M datasheet PDF, A2F060M3E-1FGG256M amp .Beyond System On Chip (SoC) Microsemi A2F060M3E-1FGG256M ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi A2F060M3E-1FGG256M


-55°C~125°C TJ 256 Pin A2F060M3E System On Chip SmartFusion® Series MCU - 26, FPGA - 66 I/O

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 256-LBGA package as per the manufacturer's specifications.A SoC chip with 16KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion® series of system on a chips.It is recommended that this SoC meaning be operated at -55°C~125°C TJ on an average.As one of the most important things to note is that this SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of MCU - 26, FPGA - 66 I/Os.As for its flash size, it is 128KB.By searching A2F060M3E, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 100MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.In this computer SoC, there are 256 pins.It just takes -55°C for the SoC computing to start up, and that is all it needs.There is a design maximum operating temperature 125°C specified for this SoC system on chip.

ARM® Cortex®-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F060M3E-1FGG256M System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
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