XC3S5000-4FG900I
- Mfr.Part #
- XC3S5000-4FG900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 633 I/O 900FBGA
- Stock
- 46,154
- In Stock :
- 46,154
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Factory Lead Time :
- 10 Weeks
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- RoHS Status :
- Non-RoHS Compliant
- Terminal Position :
- BOTTOM
- Published :
- 2009
- Total RAM Bits :
- 1916928
- Number of Outputs :
- 633
- Reach Compliance Code :
- not_compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Operating Temperature :
- -40°C~100°C TJ
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pin Count :
- 900
- Number of Inputs :
- 633
- Surface Mount :
- yes
- Speed Grade :
- 4
- Terminal Form :
- Ball
- Voltage - Supply :
- 1.14V~1.26V
- Number of Logic Elements/Cells :
- 74880
- Width :
- 31mm
- Mounting Type :
- Surface Mount
- Length :
- 31mm
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RAM Size :
- 234kB
- JESD-609 Code :
- e0
- Number of I/O :
- 633
- Packaging :
- Bulk
- Series :
- Spartan®-3
- Height Seated (Max) :
- 2.6mm
- Supply Voltage :
- 1.2V
- JESD-30 Code :
- S-PBGA-B900
- Number of Gates :
- 5000000
- Peak Reflow Temperature (Cel) :
- 225
- Operating Supply Voltage :
- 1.2V
- Number of Terminations :
- 900
- Clock Frequency :
- 630MHz
- Pbfree Code :
- No
- Power Supplies :
- 1.21.2/3.32.5V
- Package / Case :
- 900-BBGA
- Number of LABs/CLBs :
- 8320
- ECCN Code :
- 3A991.D
- Terminal Pitch :
- 1mm
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Datasheets
- XC3S5000-4FG900I

FPGAs AMD Xilinx XC3S5000-4FG900I Overview
The AMD Xilinx XC3S5000-4FG900I is a high-performance Field Programmable Gate Array (FPGA) designed to meet the evolving needs of the electronics industry. This FPGA is packed with advanced features that allow for extensive customization and scalability, making it an ideal choice for developers and engineers looking for a versatile, reliable solution. With its robust configuration, the XC3S5000-4FG900I enables efficient processing and high-speed operations in complex digital systems. The integration of 633 I/Os in a compact 900FBGA package allows for dense circuit designs, maximizing functionality while minimizing space usage.
XC3S5000-4FG900I Features
This FPGA model offers a plethora of features suitable for a wide range of applications. Key features include a high I/O count, a large 900FBGA package for complex circuit integration, and high reliability under industrial conditions. Its programmable logic allows for customization to specific needs, significantly reducing development time and cost.
XC3S5000-4FG900I Applications
- Telecommunications: The XC3S5000-4FG900I can be used to implement high-speed interfaces and data processing functions critical in network equipment, enhancing performance and reliability.
- Aerospace and Defense: This FPGA supports the rigorous requirements for processing and control applications in aerospace and defense electronics, providing the necessary robustness and security.
- Automotive: Ideal for use in advanced driver-assistance systems (ADAS), this device facilitates real-time sensor data processing and decision-making, increasing automotive safety and functionality.
- Consumer Electronics: The FPGA can be integrated into consumer electronics to enhance multimedia processing capabilities, supporting advanced graphics and high-speed data transfers.
- Industrial Automation: With its high I/O count and robustness, the XC3S5000-4FG900I is well-suited for industrial automation systems, improving control and operational efficiency.
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