XC3S1000-4FG320C

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Mfr.Part #
XC3S1000-4FG320C
Manufacturer
AMD Xilinx
Package / Case
320-BGA
Datasheet
Download
Description
IC FPGA 221 I/O 320FBGA
Stock
555
In Stock :
555

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Bulk
Factory Lead Time :
10 Weeks
RoHS Status :
Non-RoHS Compliant
Mounting Type :
Surface Mount
Number of Logic Elements/Cells :
17280
Supplier Device Package :
320-FBGA (19x19)
Package / Case :
320-BGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Speed Grade :
4
Number of LABs/CLBs :
1920
Operating Temperature :
0°C~85°C TJ
Max Operating Temperature :
85°C
Series :
Spartan®-3
RAM Size :
54kB
Min Operating Temperature :
0°C
Number of I/O :
221
Voltage - Supply :
1.14V~1.26V
Number of Gates :
1000000
Published :
2005
Operating Supply Voltage :
1.2V
Total RAM Bits :
442368
Datasheets
XC3S1000-4FG320C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000-4FG320C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:320-BGA, Operating Temperature:0°C~85°C TJ, XC3S1000-4FG320C pinout, XC3S1000-4FG320C datasheet PDF, XC3S1000-4FG320C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000-4FG320C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1000-4FG320C


FPGAs AMD Xilinx XC3S1000-4FG320C Overview

The FPGAs AMD Xilinx XC3S1000-4FG320C is a high-performance, field-programmable gate array integrated circuit designed for applications requiring significant logic processing capabilities within a compact form factor. Manufactured by AMD Xilinx, this IC leverages advanced silicon technology to provide a versatile and powerful platform that supports a wide range of functionalities. Ideal for developers looking to deploy complex algorithms and system designs efficiently, this product integrates 221 I/O ports packed into a 320FBGA package, ensuring adaptability in various high-demand environments.

XC3S1000-4FG320C Features

This FPGA device features 221 input/output options, providing extensive connectivity and interface capabilities. The 320-pin Fine Ball Grid Array (FBGA) package ensures robust physical integration while minimizing footprint on the PCB. The XC3S1000-4FG320C is engineered for optimal performance with AMD Xilinx's proprietary architecture, which supports rapid prototyping and flexible hardware configuration, allowing for accelerated product development and enhanced system reliability.

XC3S1000-4FG320C Applications

  • Telecommunications: Used in routing and switching equipment, facilitating the efficient management and processing of data traffic.
  • Automotive Systems: Ideal for driver assistance systems, integrating sensors and control mechanisms for enhanced vehicle safety.
  • Consumer Electronics: Applied in smart home devices, enabling complex logic functions and connectivity for improved user experiences.
  • Industrial Automation: Employs in control systems to perform real-time data processing and machinery control, optimizing operational efficiency.
  • Medical Devices: Utilized in diagnostic and monitoring equipment, ensuring high-speed data analysis and reliable operation under stringent conditions.
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