XC3S1000-4FGG676I

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Mfr.Part #
XC3S1000-4FGG676I
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 391 I/O 676FBGA
Stock
83
In Stock :
83

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Pbfree Code :
yes
Length :
27mm
Number of Pins :
676
Number of Logic Elements/Cells :
17280
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage :
1.2V
Base Part Number :
XC3S1000
Pin Count :
676
Published :
2006
ECCN Code :
3A991.D
Speed Grade :
4
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Package / Case :
676-BGA
Height :
1.75mm
Number of I/O :
391
Total RAM Bits :
442368
Peak Reflow Temperature (Cel) :
250
Factory Lead Time :
10 Weeks
Clock Frequency :
630MHz
Voltage - Supply :
1.14V~1.26V
Number of LABs/CLBs :
1920
Series :
Spartan®-3
Mount :
Surface Mount
Terminal Form :
Ball
Terminal Pitch :
1mm
Operating Temperature :
-40°C~100°C TJ
Qualification Status :
Not Qualified
JESD-609 Code :
e1
Combinatorial Delay of a CLB-Max :
0.61 ns
Packaging :
Tray
Number of Terminations :
676
Width :
27mm
Number of Gates :
1000000
RoHS Status :
ROHS3 Compliant
Number of Outputs :
391
Operating Supply Voltage :
1.2V
RAM Size :
54kB
Terminal Position :
BOTTOM
Power Supplies :
1.21.2/3.32.5V
Datasheets
XC3S1000-4FGG676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000-4FGG676I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:676, Base Part Number:XC3S1000, Mounting Type:Surface Mount, Package / Case:676-BGA, Operating Temperature:-40°C~100°C TJ, Number of Terminations:676, XC3S1000-4FGG676I pinout, XC3S1000-4FGG676I datasheet PDF, XC3S1000-4FGG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000-4FGG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1000-4FGG676I


FPGAs AMD Xilinx XC3S1000-4FGG676I Overview

The FPGAs AMD Xilinx XC3S1000-4FGG676I is a highly capable FPGA designed to meet the demands of complex digital processing tasks in modern electronic environments. Manufactured by the renowned AMD Xilinx, this component features a robust 676-pin ball grid array (FBGA) packaging and an array of 391 programmable I/O pins, making it highly versatile for integration across various applications. As part of the Spartan-3 FPGA series, this device offers a blend of performance, cost-effectiveness, and power efficiency, making it an ideal choice for designers looking to enhance system capabilities while managing power consumption and cost.

XC3S1000-4FGG676I Features

The XC3S1000-4FGG676I comes equipped with numerous features that make it a powerful option for system integration. These include a large gate count for handling complex algorithms and processes, a programmable logic that allows for on-the-fly adjustments and updates, and a high I/O pin count for improved connectivity and interface options. Additionally, its support for advanced digital signal processing enhances its capability to perform high-speed data manipulation and analysis.

XC3S1000-4FGG676I Applications

  • Telecommunications: The XC3S1000-4FGG676I can be used in telecommunications infrastructure to manage signal processing tasks, routing, and switching due to its high throughput and programmability.
  • Automotive: In automotive applications, this FPGA is used for driver assistance systems, where real-time data processing is crucial for vehicle safety and navigation systems.
  • Consumer Electronics: Ideal for consumer electronics such as high-definition multimedia interfaces and portable devices, where its ability to handle complex graphical processes and interface management improves user experience.
  • Industrial: This FPGA serves well in industrial automation, including robotics and control systems, where its robustness and ability to perform under demanding conditions are key advantages.
  • Medical Devices: In medical device manufacturing, the XC3S1000-4FGG676I supports the development of diagnostic and imaging equipment, benefiting from its precision and high-speed data processing capabilities.
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