XC3S1000-4FG676C

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Mfr.Part #
XC3S1000-4FG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 391 I/O 676FCBGA
Stock
2,020
In Stock :
2,020

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Power Supplies :
1.21.2/3.32.5V
Mounting Type :
Surface Mount
Number of Outputs :
391
Pin Count :
676
Packaging :
Tray
Number of Logic Elements/Cells :
17280
JESD-609 Code :
e0
Operating Temperature :
0°C~85°C TJ
Number of Pins :
676
Combinatorial Delay of a CLB-Max :
0.61 ns
Peak Reflow Temperature (Cel) :
225
Number of LABs/CLBs :
1920
Terminal Pitch :
1mm
Qualification Status :
Not Qualified
RoHS Status :
Non-RoHS Compliant
RAM Size :
54kB
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish :
Tin/Lead (Sn63Pb37)
Terminal Form :
Ball
Series :
Spartan®-3
Total RAM Bits :
442368
Clock Frequency :
630MHz
Height Seated (Max) :
2.6mm
Speed Grade :
4
Base Part Number :
XC3S1000
Length :
27mm
Pbfree Code :
No
Package / Case :
676-BBGA, FCBGA
Width :
27mm
Factory Lead Time :
10 Weeks
Number of Terminations :
676
Mount :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
30
Operating Supply Voltage :
1.2V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage :
1.2V
Number of I/O :
391
Published :
2006
Terminal Position :
BOTTOM
Voltage - Supply :
1.14V~1.26V
Number of Gates :
1000000
ECCN Code :
3A991.D
Datasheets
XC3S1000-4FG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000-4FG676C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Pins:676, Base Part Number:XC3S1000, Package / Case:676-BBGA, FCBGA, Number of Terminations:676, XC3S1000-4FG676C pinout, XC3S1000-4FG676C datasheet PDF, XC3S1000-4FG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000-4FG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1000-4FG676C


FPGAs AMD Xilinx XC3S1000-4FG676C Overview

The FPGAs AMD Xilinx XC3S1000-4FG676C is an advanced field programmable gate array designed to meet the complex digital computation needs of modern electronic systems. This high-performance IC FPGA features 391 I/O pins housed in a 676-pin flip-chip ball grid array (FCBGA) package, allowing for robust interfacing and connectivity. Tailored for versatile applications in demanding environments, this product from AMD Xilinx is engineered to offer exceptional reliability, configurability, and speed, making it an excellent choice for developers looking to harness the power of programmable logic for both commercial and industrial applications.

XC3S1000-4FG676C Features

This FPGA device offers a dynamic and customizable solution for a wide array of computing challenges. The key features include a large array of programmable logic cells, high-speed DSP slices for specialized signal processing tasks, and ample I/O options that ensure compatibility with a variety of digital and analog inputs. Moreover, its compatibility with the advanced synthesis software tools from Xilinx simplifies design implementations, thus accelerating time to market for new products and innovations.

XC3S1000-4FG676C Applications

  • Telecommunications: Utilized in communication infrastructure equipment such as routers and switches, the XC3S1000-4FG676C processes high-speed data transfers and supports complex digital signal processing tasks.
  • Automotive: Applied in advanced driver-assistance systems (ADAS), this FPGA enhances functionality by managing sensor data integration and real-time vehicle behavior analysis.
  • Consumer Electronics: Integral in devices like high-definition television sets and portable electronics, where it enables rapid video processing and enhanced graphic displays.
  • Industrial: Used in control systems for machinery and robotic applications, offering flexible reprogramming capabilities to adapt to new automation tasks.
  • Medical Devices: Critical in medical imaging systems, such as ultrasound and MRI machines, helping in the processing of complex visualization data and patient monitoring systems.
This HTML content is designed to highlight the unique features and broad applicability of the XC3S1000-4FG676C FPGA, positioning it effectively for B2B customers interested in versatile and powerful electronic components.
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