XC3S1000-4FG456C

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Mfr.Part #
XC3S1000-4FG456C
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 333 I/O 456FBGA
Stock
5,016
In Stock :
5,016

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
1920
Operating Supply Voltage :
1.2V
Pin Count :
456
Supply Voltage :
1.2V
Length :
23mm
Qualification Status :
Not Qualified
Pbfree Code :
No
Terminal Position :
BOTTOM
Published :
2006
Terminal Form :
Ball
Number of Gates :
1000000
Surface Mount :
yes
Number of Inputs :
333
Package / Case :
456-BBGA
Height Seated (Max) :
2.6mm
Terminal Finish :
Tin/Lead (Sn63Pb37)
JESD-609 Code :
e0
Mounting Type :
Surface Mount
Series :
Spartan®-3
Combinatorial Delay of a CLB-Max :
0.61 ns
RAM Size :
54kB
ECCN Code :
3A991.D
Number of Logic Elements/Cells :
17280
Factory Lead Time :
10 Weeks
Number of I/O :
333
Number of Outputs :
333
Speed Grade :
4
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Width :
23mm
Peak Reflow Temperature (Cel) :
225
Packaging :
Bulk
Total RAM Bits :
442368
Power Supplies :
1.21.2/3.32.5V
Operating Temperature :
0°C~85°C TJ
Number of Terminations :
456
Terminal Pitch :
1mm
Time@Peak Reflow Temperature-Max (s) :
30
RoHS Status :
Non-RoHS Compliant
Clock Frequency :
630MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
1.14V~1.26V
Datasheets
XC3S1000-4FG456C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000-4FG456C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:456-BBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Terminations:456, XC3S1000-4FG456C pinout, XC3S1000-4FG456C datasheet PDF, XC3S1000-4FG456C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000-4FG456C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1000-4FG456C


FPGAs AMD Xilinx XC3S1000-4FG456C Overview

The FPGAs AMD Xilinx XC3S1000-4FG456C is a highly capable field-programmable gate array designed for applications requiring a flexible, high-performance hardware solution that can adapt to varying requirements. Manufactured by AMD Xilinx, this IC features 333 I/O pins housed in a 456FBGA package, making it ideally suited for complex digital computations and high-speed digital interfacing. This FPGA allows for rapid prototyping and deployment across a broad range of industries, ensuring that it meets the needs of the most demanding applications with reliability and efficiency.

XC3S1000-4FG456C Features

The XC3S1000-4FG456C FPGA from AMD Xilinx offers several distinctive features that make it an excellent choice for designers looking to leverage flexibility and performance. Key features include a robust 456-pin ball grid array (BGA) packaging that ensures a secure and reliable connection, 333 available I/Os for extensive interfacing capabilities, and a scalable architecture that supports a wide range of applications. The device also supports multiple design methodologies including VHDL and Verilog, allowing for a versatile approach to development and integration.

XC3S1000-4FG456C Applications

  • Telecommunications Infrastructure: Utilized in routers and switches for packet processing and data flow management, ensuring high-speed data transmission and network reliability.
  • Consumer Electronics: Deployed in devices such as high-definition televisions and gaming consoles to handle complex video processing and enhance user experience.
  • Automotive Systems: Integrated into driver assistance systems to perform real-time image and sensor data analysis, contributing to safer driving conditions.
  • Industrial Automation: Used in control systems to manage and monitor machinery operation, increasing precision and productivity in manufacturing environments.
  • Aerospace and Defense: Applies in navigation systems and communication devices to ensure mission-critical performance in extreme conditions.
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