XC3S1200E-5FGG320C
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- Mfr.Part #
- XC3S1200E-5FGG320C
- Manufacturer
- AMD Xilinx
- Package / Case
- 320-BGA
- Datasheet
- Download
- Description
- IC FPGA 250 I/O 320FBGA
- Stock
- 2,328
- In Stock ：
- 2,328
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Registers :
- 17344
- Height Seated (Max) :
- 2mm
- Number of Outputs :
- 194
- Base Part Number :
- XC3S1200E
- Factory Lead Time :
- 10 Weeks
- Number of Pins :
- 320
- Number of I/O :
- 250
- Series :
- Spartan®-3E
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mounting Type :
- Surface Mount
- Package / Case :
- 320-BGA
- Operating Supply Voltage :
- 1.2V
- Published :
- 2009
- Speed Grade :
- 5
- Combinatorial Delay of a CLB-Max :
- 0.66 ns
- Number of Logic Elements/Cells :
- 19512
- Terminal Pitch :
- 1mm
- Packaging :
- Tray
- Width :
- 19mm
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Position :
- BOTTOM
- Terminal Form :
- Ball
- Number of LABs/CLBs :
- 2168
- Pin Count :
- 320
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RAM Size :
- 63kB
- Qualification Status :
- Not Qualified
- Number of Terminations :
- 320
- Total RAM Bits :
- 516096
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Length :
- 19mm
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Pbfree Code :
- yes
- Mount :
- Surface Mount
- Number of Gates :
- 1200000
- RoHS Status :
- ROHS3 Compliant
- ECCN Code :
- 3A991.D
- Voltage - Supply :
- 1.14V~1.26V
- Peak Reflow Temperature (Cel) :
- 260
- Supply Voltage :
- 1.2V
- JESD-609 Code :
- e1
- Datasheets
- XC3S1200E-5FGG320C
FPGAs AMD Xilinx XC3S1200E-5FGG320C Overview
The FPGAs AMD Xilinx XC3S1200E-5FGG320C is a high-performance, field-programmable gate array designed for robust digital processing and complex logic operations. Crafted by AMD Xilinx, this FPGA integrates advanced features suitable for a variety of demanding applications. Its flexible nature combined with superior design efficiency allows for rapid deployment in systems requiring high-speed data processing and significant I/O capabilities. With its 320-pin fine-pitch ball grid array (FBGA) package, it offers a compact solution for dense board layouts, making it an ideal choice for manufacturers aiming to achieve innovative, space-efficient designs.
XC3S1200E-5FGG320C Features
The XC3S1200E-5FGG320C FPGA stands out with its 250 I/O pins, facilitating extensive interfacing with a wide range of peripherals and other digital systems. This high I/O capacity is critical in applications requiring numerous connections, such as high-speed networking or complex user interfaces. The device operates efficiently under the 5FGG technology, ensuring reliable performance even under stringent operational conditions. This FPGA is designed to meet the needs of advanced digital computing environments, providing a versatile platform for developing high-tech solutions.
XC3S1200E-5FGG320C Applications
- Telecommunications: In telecom equipment, the XC3S1200E-5FGG320C can manage multiple data streams and protocols, enhancing signal integrity and network reliability.
- Automotive Systems: Utilized in vehicle electronics, it supports advanced driver-assistance systems (ADAS) by processing inputs from various sensors and cameras in real time.
- Consumer Electronics: In devices such as smartphones and tablets, this FPGA accelerates processing for multimedia applications, ensuring smooth video playback and gaming experiences.
- Industrial Automation: It is applied in control systems for real-time operations monitoring and management, improving efficiency and safety in manufacturing processes.
- Medical Devices: This FPGA aids in the processing and analysis of complex data in medical imaging equipment, contributing to faster and more accurate diagnoses.
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