S29GL256P11TFI010
- Mfr.Part #
- S29GL256P11TFI010
- Manufacturer
- Spansion
- Package / Case
- 56-TFSOP (0.724, 18.40mm Width)
- Datasheet
- Download
- Description
- FLASH, 256MX1, 110NS, PDSO56
- Stock
- 3,270
- In Stock :
- 3,270
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- Manufacturer :
- Spansion
- Product Category :
- Memory
- Supply Voltage-Min (Vsup) :
- 2.7V
- Command User Interface :
- yes
- HTS Code :
- 8542.32.00.51
- Mount :
- Surface Mount
- Terminal Pitch :
- 0.5mm
- Sync/Async :
- ASYNCHRONOUS
- Peak Reflow Temperature (Cel) :
- 260
- Write Cycle Time - Word, Page :
- 110ns
- Voltage - Supply :
- 2.7V~3.6V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Type :
- Non-Volatile
- Number of Pins :
- 56
- Terminal Finish :
- Matte Tin (Sn)
- ECCN Code :
- 3A991.B.1.A
- REACH SVHC :
- No SVHC
- Series :
- GL-P
- Density :
- 256 Mb
- Lead Free :
- Lead Free
- Supply Voltage :
- 3V
- Packaging :
- Tray
- Ready/Busy :
- yes
- Programming Voltage :
- 3V
- Memory Format :
- Flash
- Memory Size :
- 256Mb 32M x 8
- Terminal Position :
- Dual
- Page Size :
- 8/16words
- Standby Current-Max :
- 0.000005A
- Radiation Hardening :
- No
- Data Bus Width :
- 8B
- Mounting Type :
- Surface Mount
- Number of Functions :
- 1
- Access Time (Max) :
- 110 ns
- Memory Width :
- 1
- JESD-609 Code :
- e3
- Factory Lead Time :
- 16 Weeks
- Alternate Memory Width :
- 8
- Sector Size :
- 128K
- Package / Case :
- 56-TFSOP (0.724, 18.40mm Width)
- Length :
- 18.4mm
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Number of Sectors/Size :
- 256
- Supply Voltage-Max (Vsup) :
- 3.6V
- Common Flash Interface :
- yes
- Memory Interface :
- Parallel
- Data Polling :
- yes
- Number of Terminations :
- 56
- Height Seated (Max) :
- 1.2mm
- RoHS Status :
- ROHS3 Compliant
- Nominal Supply Current :
- 110mA
- Power Supplies :
- 3/3.3V
- Toggle Bit :
- yes
- Operating Temperature :
- -40°C~85°C TA
- Published :
- 2012
- Datasheets
- S29GL256P11TFI010

Memory Spansion S29GL256P11TFI010 Overview
The Memory Spansion S29GL256P11TFI010 FLASH chip is a cutting-edge storage solution that combines high capacity with excellent performance metrics. Designed for applications requiring robust, non-volatile memory, this FLASH chip offers a 256Mx1 configuration and a speedy 110 ns access time. Encased in a PDSO56 package, it is ideal for high-density applications where space and speed are at a premium. This product is tailored to meet the rigorous demands of industrial and commercial applications, making it a preferred choice for businesses looking to invest in top-tier memory solutions.
S29GL256P11TFI010 Features
This FLASH memory chip comes with several features that make it an excellent choice for a wide range of applications. Key features include a large 256MX1 memory size and a fast access time of 110 ns, which ensure quick data retrieval and high efficiency in operation. The PDSO56 package is compact and suitable for dense circuit designs, providing reliability and durability in challenging environments.
S29GL256P11TFI010 Applications
- Automotive Electronics: Utilized in engine control units, infotainment systems, and advanced driver assistance systems, where reliability and speed are crucial.
- Communication Equipment: Supports the demands of high-speed communication devices, such as routers and switches, enhancing performance and data integrity.
- Industrial Control Systems: Ideal for use in PLCs and other control systems requiring fast and reliable memory to handle complex processes and real-time operations.
- Medical Devices: Applied in critical medical equipment where precision and dependability of data storage are paramount, such as imaging systems and patient monitors.
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