S29GL256P11FFIV22

Manufacturer :

Infineon Technologies

Product Category :

Memory

Ready/Busy :

yes

Operating Mode :

ASYNCHRONOUS

Memory Density :

268435456 bit

Page Size :

8/16words

Number of Functions :

1

Factory Lead Time :

16 Weeks

Time@Peak Reflow Temperature-Max (s) :

40

Operating Temperature :

-40°C~85°C TA

Number of Terminations :

64

Supply Voltage-Min (Vsup) :

2.7V

Terminal Position :

BOTTOM

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of Pins :

64

ECCN Code :

3A991.B.1.A

Alternate Memory Width :

8

Common Flash Interface :

yes

Width :

11mm

Organization :

256MX1

RoHS Status :

ROHS3 Compliant

Memory Interface :

Parallel

Toggle Bit :

yes

Series :

GL-P

Supply Voltage :

3V

Data Polling :

yes

Supply Current-Max :

0.11mA

JESD-609 Code :

e1

Memory Size :

256Mb 32M x 8

Standby Current-Max :

0.000005A

Qualification Status :

Not Qualified

Memory Type :

Non-Volatile

Length :

13mm

Memory Width :

1

Supply Voltage-Max (Vsup) :

3.6V

Number of Sectors/Size :

256

Memory Format :

Flash

Command User Interface :

yes

Access Time (Max) :

110 ns

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

HTS Code :

8542.32.00.51

Voltage - Supply :

1.65V~3.6V

Height Seated (Max) :

1.4mm

Peak Reflow Temperature (Cel) :

260

Programming Voltage :

3V

Surface Mount :

yes

Sector Size :

128K

Package / Case :

64-LBGA

Packaging :

Tape and Reel (TR)

Write Cycle Time - Word, Page :

110ns

Mounting Type :

Surface Mount

Power Supplies :

1.8/3.33/3.3V

Terminal Pitch :

1mm