S29GL256P11FFI022

Manufacturer :

Infineon Technologies

Product Category :

Memory

Memory Type :

Non-Volatile

Mounting Type :

Surface Mount

Number of Terminations :

64

RoHS Status :

ROHS3 Compliant

Page Size :

8/16words

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

40

Memory Size :

256Mb 32M x 8

Number of Functions :

1

Memory Interface :

Parallel

Width :

11mm

Radiation Hardening :

No

Package / Case :

64-LBGA

Length :

13mm

Voltage - Supply :

2.7V~3.6V

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Power Supplies :

3/3.3V

Alternate Memory Width :

8

Factory Lead Time :

16 Weeks

Memory Width :

1

ECCN Code :

3A991.B.1.A

Sector Size :

128K

Write Cycle Time - Word, Page :

110ns

Number of Pins :

64

Command User Interface :

yes

Packaging :

Tape and Reel (TR)

Sync/Async :

ASYNCHRONOUS

Operating Temperature :

-40°C~85°C TA

Terminal Pitch :

1mm

Access Time (Max) :

110 ns

Standby Current-Max :

0.000005A

Supply Voltage :

3V

Density :

256 Mb

Number of Sectors/Size :

256

Ready/Busy :

yes

Mount :

Surface Mount

Supply Voltage-Min (Vsup) :

2.7V

Common Flash Interface :

yes

HTS Code :

8542.32.00.51

Peak Reflow Temperature (Cel) :

260

JESD-609 Code :

e1

Organization :

256MX1

Published :

2015

Supply Voltage-Max (Vsup) :

3.6V

Height Seated (Max) :

1.4mm

Programming Voltage :

3V

Data Polling :

yes

Toggle Bit :

yes

Series :

GL-P

Memory Format :

Flash

Terminal Position :

BOTTOM

Nominal Supply Current :

110mA