S29GL256P11FFI012

Manufacturer :

Infineon Technologies

Product Category :

Memory

Radiation Hardening :

No

RoHS Status :

ROHS3 Compliant

Terminal Pitch :

1mm

Memory Size :

256Mb 32M x 8

Package / Case :

64-LBGA

Sync/Async :

ASYNCHRONOUS

Memory Type :

Non-Volatile

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Number of Functions :

1

Factory Lead Time :

16 Weeks

Memory Interface :

Parallel

Common Flash Interface :

yes

Power Supplies :

3/3.3V

HTS Code :

8542.32.00.51

Published :

2003

JESD-609 Code :

e1

Voltage - Supply :

2.7V~3.6V

Nominal Supply Current :

110mA

Series :

GL-P

Standby Current-Max :

0.000005A

Time@Peak Reflow Temperature-Max (s) :

40

Supply Voltage-Max (Vsup) :

3.6V

Alternate Memory Width :

8

Toggle Bit :

yes

Supply Voltage-Min (Vsup) :

2.7V

Supply Voltage :

3V

Number of Terminations :

64

Mount :

Surface Mount

Ready/Busy :

yes

Width :

11mm

Write Cycle Time - Word, Page :

110ns

Page Size :

8/16words

Data Polling :

yes

Packaging :

Tape and Reel (TR)

Density :

256 Mb

Operating Temperature :

-40°C~85°C TA

Length :

13mm

Number of Pins :

64

Memory Width :

1

Organization :

256MX1

Memory Format :

Flash

Height Seated (Max) :

1.4mm

Mounting Type :

Surface Mount

Terminal Position :

BOTTOM

Peak Reflow Temperature (Cel) :

260

Programming Voltage :

3V

Sector Size :

128K

Command User Interface :

yes

Access Time (Max) :

110 ns

Number of Sectors/Size :

256

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

ECCN Code :

3A991.B.1.A