S29GL256P11FFI012

Manufacturer :

Infineon Technologies

Product Category :

Memory

RoHS Status :

ROHS3 Compliant

Density :

256 Mb

Number of Functions :

1

Radiation Hardening :

No

Length :

13mm

Memory Format :

Flash

HTS Code :

8542.32.00.51

Nominal Supply Current :

110mA

Height Seated (Max) :

1.4mm

Number of Pins :

64

Number of Sectors/Size :

256

Supply Voltage-Max (Vsup) :

3.6V

Data Polling :

yes

Write Cycle Time - Word, Page :

110ns

Standby Current-Max :

0.000005A

Memory Width :

1

ECCN Code :

3A991.B.1.A

Toggle Bit :

yes

JESD-609 Code :

e1

Published :

2003

Mounting Type :

Surface Mount

Ready/Busy :

yes

Common Flash Interface :

yes

Page Size :

8/16words

Memory Interface :

Parallel

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Packaging :

Tape and Reel (TR)

Access Time (Max) :

110 ns

Number of Terminations :

64

Alternate Memory Width :

8

Mount :

Surface Mount

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Memory Type :

Non-Volatile

Memory Size :

256Mb 32M x 8

Sector Size :

128K

Organization :

256MX1

Operating Temperature :

-40°C~85°C TA

Factory Lead Time :

16 Weeks

Terminal Pitch :

1mm

Power Supplies :

3/3.3V

Supply Voltage :

3V

Command User Interface :

yes

Programming Voltage :

3V

Supply Voltage-Min (Vsup) :

2.7V

Voltage - Supply :

2.7V~3.6V

Package / Case :

64-LBGA

Series :

GL-P

Width :

11mm

Sync/Async :

ASYNCHRONOUS

Time@Peak Reflow Temperature-Max (s) :

40

Peak Reflow Temperature (Cel) :

260

Terminal Position :

BOTTOM