S29GL256P11FFI010

Manufacturer :

Infineon Technologies

Product Category :

Memory

Mounting Type :

Surface Mount

Command User Interface :

yes

Supply Voltage-Max (Vsup) :

3.6V

Height Seated (Max) :

1.4mm

Number of Functions :

1

ECCN Code :

3A991.B.1.A

Number of Sectors/Size :

256

Voltage - Supply :

2.7V~3.6V

Operating Temperature :

-40°C~85°C TA

Ready/Busy :

yes

Page Size :

8/16words

Access Time (Max) :

110 ns

RoHS Status :

ROHS3 Compliant

Terminal Pitch :

1mm

Data Bus Width :

8B

Time@Peak Reflow Temperature-Max (s) :

40

Memory Size :

256Mb 32M x 8

REACH SVHC :

No SVHC

Organization :

256MX1

Memory Format :

Flash

Alternate Memory Width :

8

JESD-609 Code :

e1

Length :

13mm

Write Cycle Time - Word, Page :

110ns

Sector Size :

128K

HTS Code :

8542.32.00.51

Standby Current-Max :

0.000005A

Power Supplies :

3/3.3V

Mount :

Surface Mount

Programming Voltage :

3V

Number of Terminations :

64

Contact Plating :

Copper, Silver, Tin

Supply Voltage :

3V

Memory Type :

Non-Volatile

Memory Interface :

Parallel

Peak Reflow Temperature (Cel) :

260

Common Flash Interface :

yes

Series :

GL-P

Supply Voltage-Min (Vsup) :

2.7V

Lead Free :

Lead Free

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Number of Pins :

64

Package / Case :

64-LBGA

Radiation Hardening :

No

Density :

256 Mb

Nominal Supply Current :

110mA

Memory Width :

1

Terminal Position :

BOTTOM

Published :

2012

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Toggle Bit :

yes

Sync/Async :

ASYNCHRONOUS

Data Polling :

yes

Factory Lead Time :

16 Weeks

Packaging :

Tray