S29GL256P10FFI022

Manufacturer :

Infineon Technologies

Product Category :

Memory

Ready/Busy :

yes

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Peak Reflow Temperature (Cel) :

260

Terminal Position :

BOTTOM

Data Polling :

yes

Memory Format :

Flash

Memory Width :

1

Voltage - Supply :

2.7V~3.6V

Published :

2003

Access Time (Max) :

100 ns

Mounting Type :

Surface Mount

Memory Size :

256Mb 32M x 8

Supply Voltage :

3V

Mount :

Surface Mount

Nominal Supply Current :

110mA

Power Supplies :

3/3.3V

Number of Terminations :

64

Factory Lead Time :

16 Weeks

Packaging :

Tape and Reel (TR)

Number of Functions :

1

Write Cycle Time - Word, Page :

100ns

RoHS Status :

ROHS3 Compliant

Toggle Bit :

yes

Command User Interface :

yes

Organization :

256MX1

Series :

GL-P

Density :

256 Mb

Number of Sectors/Size :

256

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Pitch :

1mm

Supply Voltage-Max (Vsup) :

3.6V

Alternate Memory Width :

8

ECCN Code :

3A991.B.1.A

Page Size :

8/16words

Number of Pins :

64

Time@Peak Reflow Temperature-Max (s) :

40

Supply Voltage-Min (Vsup) :

2.7V

JESD-609 Code :

e1

Sector Size :

128K

Operating Temperature :

-40°C~85°C TA

Height Seated (Max) :

1.4mm

Package / Case :

64-LBGA

Qualification Status :

Not Qualified

Sync/Async :

ASYNCHRONOUS

Memory Type :

Non-Volatile

Length :

13mm

Programming Voltage :

3V

Standby Current-Max :

0.000005A

Memory Interface :

Parallel

HTS Code :

8542.32.00.51

Common Flash Interface :

yes

Data Bus Width :

8B