S29GL032N90FFI033

Manufacturer :

Infineon Technologies

Product Category :

Memory

HTS Code :

8542.32.00.51

Organization :

2MX16

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Published :

2015

Page Size :

8/16words

Time@Peak Reflow Temperature-Max (s) :

40

Memory Format :

Flash

Mounting Type :

Surface Mount

JESD-609 Code :

e1

Supply Voltage-Max (Vsup) :

3.6V

Surface Mount :

yes

Memory Width :

16

Peak Reflow Temperature (Cel) :

260

Standby Current-Max :

0.000005A

Packaging :

Tape and Reel (TR)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Write Cycle Time - Word, Page :

90ns

Programming Voltage :

3V

Number of Terminations :

64

Height Seated (Max) :

1.4mm

Series :

GL-N

Number of Pins :

64

Boot Block :

Top

Memory Size :

32Mb 4M x 8 2M x 16

Ready/Busy :

yes

Supply Voltage-Min (Vsup) :

2.7V

Power Supplies :

3/3.3V

Data Polling :

yes

Alternate Memory Width :

8

Number of Sectors/Size :

863

Number of Functions :

1

Voltage - Supply :

2.7V~3.6V

Operating Mode :

ASYNCHRONOUS

Qualification Status :

Not Qualified

RoHS Status :

ROHS3 Compliant

Access Time (Max) :

90 ns

Terminal Pitch :

1mm

Width :

11mm

Operating Temperature :

-40°C~85°C TA

Toggle Bit :

yes

Command User Interface :

yes

Supply Current-Max :

0.05mA

Package / Case :

64-LBGA

Supply Voltage :

3V

Common Flash Interface :

yes

Terminal Position :

BOTTOM

Memory Interface :

Parallel

Memory Type :

Non-Volatile

ECCN Code :

3A991.B.1.A

Length :

13mm

Memory Density :

33554432 bit