IRLI2910
- Mfr.Part #
- IRLI2910
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-220-3 Full Pack
- Datasheet
- Download
- Description
- MOSFET N-CH 100V 31A TO220AB FP
- Stock
- 18,061
- In Stock :
- 18,061
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- FET Type :
- N-Channel
- Current - Continuous Drain (Id) @ 25°C :
- 31A Tc
- Drain to Source Voltage (Vdss) :
- 100V
- Number of Elements :
- 1
- Terminal Position :
- Single
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Package / Case :
- TO-220-3 Full Pack
- Avalanche Energy Rating (Eas) :
- 520 mJ
- Vgs (Max) :
- ±16V
- Rds On (Max) @ Id, Vgs :
- 26m Ω @ 16A, 10V
- Series :
- HEXFET®
- Published :
- 1998
- Case Connection :
- Isolated
- Operating Mode :
- ENHANCEMENT MODE
- Drive Voltage (Max Rds On,Min Rds On) :
- 4V 10V
- Surface Mount :
- No
- Drain-source On Resistance-Max :
- 0.03Ohm
- Gate Charge (Qg) (Max) @ Vgs :
- 140nC @ 5V
- Pulsed Drain Current-Max (IDM) :
- 190A
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Vgs(th) (Max) @ Id :
- 2V @ 250μA
- DS Breakdown Voltage-Min :
- 100V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Transistor Application :
- SWITCHING
- ECCN Code :
- EAR99
- Transistor Element Material :
- SILICON
- Qualification Status :
- Not Qualified
- Drain Current-Max (Abs) (ID) :
- 31A
- Input Capacitance (Ciss) (Max) @ Vds :
- 3700pF @ 25V
- Mounting Type :
- Through Hole
- JESD-30 Code :
- R-PSFM-T3
- Operating Temperature :
- -55°C~175°C TJ
- Number of Terminations :
- 3
- Packaging :
- Tube
- Power Dissipation-Max :
- 63W Tc
- JEDEC-95 Code :
- TO-220AB
- Additional Feature :
- AVALANCHE RATED
- RoHS Status :
- Non-RoHS Compliant
- Datasheets
- IRLI2910

N-Channel Tube 26m Ω @ 16A, 10V ±16V 3700pF @ 25V 140nC @ 5V 100V TO-220-3 Full Pack
Description
The IRLI2910 is a 100V Single N-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package. International Rectifier's Fifth Generation HEXFETs use cutting-edge processing methods to achieve exceptionally low on-resistance per silicon area. This feature offers the designer a highly effective and dependable device for usage in various applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.
In commercial and industrial applications, the TO-220 Full Pak eliminates the need for additional insulating gear. The molding material utilized offers thermal solid isolation between the tab and external heat sink and low thermal resistance. This isolation is comparable to employing a mica barrier with a conventional TO-220 product that is 100 microns thick. A single clip or single screw can be used to fix the Fullpak to a heat sink.
Features
-
Fast Switching
-
High Voltage Isolation = 2.5KVRMS ?
-
Sink to Lead Creepage Dist. = 4.8mm
-
Fully Avalanche Rated
-
Lead-Free
-
Logic ¨CLevel Gate Drive
-
Advanced Process Technology
-
Ultra Low On-Resistance
-
Isolated Package
Applications
-
Switch Mode Power Supplies (SMPS)
-
Power-Over-Ethernet (PoE)
-
Solar inverters
-
Automotive applications
-
Switch, buck and synchronous rectification
-
Uninterruptible Power Supplies (UPS)
-
Small motor control
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