IRLI2505
- Mfr.Part #
- IRLI2505
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-220-3 Full Pack
- Datasheet
- Download
- Description
- MOSFET N-CH 55V 58A TO220AB FP
- Stock
- 10,375
- In Stock :
- 10,375
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- * Fullname:
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Reference Standard :
- AEC-Q101
- Series :
- HEXFET®
- RoHS Status :
- Non-RoHS Compliant
- Rds On (Max) @ Id, Vgs :
- 8m Ω @ 31A, 10V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Current - Continuous Drain (Id) @ 25°C :
- 58A Tc
- Gate Charge (Qg) (Max) @ Vgs :
- 130nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds :
- 5000pF @ 25V
- ECCN Code :
- EAR99
- FET Type :
- N-Channel
- Additional Feature :
- AVALANCHE RATED, FAST SWITCHING
- Mounting Type :
- Through Hole
- Vgs(th) (Max) @ Id :
- 2V @ 250μA
- Vgs (Max) :
- ±16V
- Operating Temperature :
- -55°C~175°C TJ
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Case Connection :
- Isolated
- Packaging :
- Tube
- Drain-source On Resistance-Max :
- 0.01Ohm
- Operating Mode :
- ENHANCEMENT MODE
- Power Dissipation-Max :
- 63W Tc
- Surface Mount :
- No
- Drain Current-Max (Abs) (ID) :
- 58A
- Drain to Source Voltage (Vdss) :
- 55V
- DS Breakdown Voltage-Min :
- 55V
- Transistor Element Material :
- SILICON
- Published :
- 1997
- Avalanche Energy Rating (Eas) :
- 500 mJ
- Drive Voltage (Max Rds On,Min Rds On) :
- 4V 10V
- Pulsed Drain Current-Max (IDM) :
- 360A
- Number of Elements :
- 1
- Package / Case :
- TO-220-3 Full Pack
- Transistor Application :
- SWITCHING
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Datasheets
- IRLI2505

N-Channel Tube 8m Ω @ 31A, 10V ±16V 5000pF @ 25V 130nC @ 5V 55V TO-220-3 Full Pack
IRLI2505 Description
International Rectifier's Fifth Generation HEXFETs use cutting-edge manufacturing methods to provide the lowest on-resistance per silicon area. This feature gives the designer a very effective device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.
In commercial and industrial applications, the TO-220 Fullpak replaces the requirement for additional insulating gear. Between the tab and external heatsink, the molding material employed has a strong thermal isolation capability. This isolation is comparable to employing a mica barrier with a conventional TO-220 product that is 100 microns thick. A single clip or single screw can be used to fix the Fullpak to a heatsink.
IRLI2505 Features
-
Logic-Level Gate Drive
-
Advanced Process Technology
-
Ultra Low On-Resistance
-
Isolated Package
-
High Voltage Isolation = 2.5KVRMS ?
-
Sink to Lead Creepage Dist. = 4.8mm
-
Fully Avalanche Rated
IRLI2505 Applications
-
Power Management
-
Consumer Electronics
-
Portable Devices
-
Industrial
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