XCVU9P-L2FLGB2104E

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Mfr.Part #
XCVU9P-L2FLGB2104E
Manufacturer
AMD Xilinx
Package / Case
2104-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 702 I/O 2104FCBGA
Stock
7,605
In Stock :
7,605

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
391168000
Package / Case :
2104-BBGA, FCBGA
Operating Temperature :
0°C~110°C TJ
Number of Logic Elements/Cells :
2586150
Packaging :
Tray
Series :
Virtex® UltraScale+™
Factory Lead Time :
13 Weeks
Reach Compliance Code :
not_compliant
Number of I/O :
702
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mounting Type :
Surface Mount
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
0.698V~0.742V
HTS Code :
8542.39.00.01
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of LABs/CLBs :
147780
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU9P-L2FLGB2104E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2104-BBGA, FCBGA, Operating Temperature:0°C~110°C TJ, Mounting Type:Surface Mount, XCVU9P-L2FLGB2104E pinout, XCVU9P-L2FLGB2104E datasheet PDF, XCVU9P-L2FLGB2104E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU9P-L2FLGB2104E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA

XCVU9P-L2FLGB2104E Overview


The package that contains this software is called 2104-BBGA, FCBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 702 I/Os for better data transfer. In order to construct a fundamental building block, 2586150 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 0.698V~0.742V battery. There are many types of FPGAs in the Virtex® UltraScale+™ series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~110°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 391168000. 147780 LABs/CLBs are configured on this FPGA.

XCVU9P-L2FLGB2104E Features


702 I/Os
Up to 391168000 RAM bits


XCVU9P-L2FLGB2104E Applications


There are a lot of Xilinx Inc.
XCVU9P-L2FLGB2104E FPGAs applications.


  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
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