XCVU080-1FFVB1760I

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Mfr.Part #
XCVU080-1FFVB1760I
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 702 I/O 1760FCBGA
Stock
31,170
In Stock :
31,170

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of CLBs :
672
Number of I/O :
702
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
JESD-609 Code :
e1
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position :
BOTTOM
Terminal Pitch :
1mm
Organization :
672 CLBS
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Logic Elements/Cells :
975000
Supply Voltage :
0.95V
JESD-30 Code :
S-PBGA-B1760
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Surface Mount :
yes
Factory Lead Time :
10 Weeks
Width :
42.5mm
Height Seated (Max) :
3.81mm
Package / Case :
1760-BBGA, FCBGA
Terminal Form :
Ball
ECCN Code :
3A001.A.7.B
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Packaging :
Bulk
Total RAM Bits :
51200000
Length :
42.5mm
Operating Temperature :
-40°C~100°C TJ
Number of LABs/CLBs :
55714
Voltage - Supply :
0.922V~0.979V
Published :
2012
HTS Code :
8542.39.00.01
Series :
Virtex® UltraScale™
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU080-1FFVB1760I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:1760-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, XCVU080-1FFVB1760I pinout, XCVU080-1FFVB1760I datasheet PDF, XCVU080-1FFVB1760I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU080-1FFVB1760I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



3.81mm mm FPGAs Virtex® UltraScale™ Series 1760-BBGA, FCBGA 1mm mm

XCVU080-1FFVB1760I Overview


A 1760-BBGA, FCBGA package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 702 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 975000 logic elements/cells. An electrical supply voltage of 0.95V powers it. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 0.922V~0.979V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Virtex® UltraScale™ series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. It is for space saving reasons that this FPGA model is contained in Bulk. The RAM bits that are offered by this fpga chips are 51200000. Fpga electronics contains 55714 LABs/CLBs in an array. In its architecture, there are 672 CLB modules.

XCVU080-1FFVB1760I Features


702 I/Os
Up to 51200000 RAM bits


XCVU080-1FFVB1760I Applications


There are a lot of Xilinx Inc.
XCVU080-1FFVB1760I FPGAs applications.


  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
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