XCVU080-H1FFVC1517E

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Mfr.Part #
XCVU080-H1FFVC1517E
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 520 I/O 1517FCBGA
Stock
38,151
In Stock :
38,151

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
51200000
Series :
Virtex® UltraScale™
Packaging :
Tray
Number of I/O :
520
Factory Lead Time :
10 Weeks
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Voltage - Supply :
0.922V~1.030V
Number of LABs/CLBs :
55714
RoHS Status :
ROHS3 Compliant
Number of Logic Elements/Cells :
975000
Package / Case :
1517-BBGA, FCBGA
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
0°C~100°C TJ
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU080-H1FFVC1517E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:1517-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, XCVU080-H1FFVC1517E pinout, XCVU080-H1FFVC1517E datasheet PDF, XCVU080-H1FFVC1517E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU080-H1FFVC1517E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU080-H1FFVC1517E


FPGAs AMD Xilinx XCVU080-H1FFVC1517E Overview

The FPGAs AMD Xilinx XCVU080-H1FFVC1517E is a state-of-the-art integrated circuit developed by AMD Xilinx, tailored for advanced digital processing and high-speed interfaces. As part of the highly acclaimed FPGA family, this device offers robust adaptability and performance, making it ideal for complex applications requiring rapid prototyping and scalable solutions. Its compact 1517FCBGA package efficiently manages a large array of 520 I/O options, allowing seamless integration into multiple high-demand environments. The versatility and high performance of the XCVU080-H1FFVC1517E make it a superior choice for developers looking to leverage cutting-edge technology for industrial, commercial, and technological advancements.

XCVU080-H1FFVC1517E Features

This advanced FPGA device boasts significant features designed to enhance computational efficiency and flexibility. Key features include its extensive I/O capability, a robust 1517-pin flip-chip BGA (FCBGA) package ensuring secure and reliable connections, and advanced design suited for multifaceted applications that require high-speed data processing and transmission.

XCVU080-H1FFVC1517E Applications

  • Data Centers: Utilizes its high I/O count and fast processing capabilities to manage vast amounts of data, enhancing data retrieval and storage efficiency.
  • Telecommunications: Supports complex digital signal processing tasks essential for modern telecom infrastructures, including 5G networks and Internet of Things (IoT) connectivity.
  • Automotive Systems: Integrates into driver assistance systems, providing the necessary computing power for real-time decision making and vehicle automation.
  • Medical Imaging Equipment: Enables high-speed data processing for real-time imaging technologies, crucial in diagnostic systems like MRI and CT scanners.
  • Aerospace and Defense: Applies its robust processing abilities to handle navigation and communication systems' computational needs in extreme environments.
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